Apparatus, system, and method for electronics manufacturing using direct write with fabricated foils

Abstract

An apparatus system and method for an electronic component made with additive manufacturing processes and a foil substrate is provided. The electronic component may include one or more foil substrates and one or more elements. The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures.

What is claimed is: 
     
         1 . A method, comprising:
 producing a first foil from a metal substrate by at least one of an etching process or micro-machining process, wherein the foil is a portion of a circuit;   writing a first structure by depositing conductive material via a direct write manufacturing process to the first foil, wherein the first structure is substantially in a plane defined by the first foil; and   writing a second structure by depositing conductive material via the direct write manufacturing process to the first foil, wherein at least a portion of the second structure is substantially out of the plane defined by the first foil.   
     
     
         2 . The method of  claim 1 , further comprising pre-processing the first foil, wherein the pre-processing includes treating the foil to facilitate bonding of at least one of the first structure or the second structure. 
     
     
         3 . The method of  claim 1 , further comprising post-processing an electronic assembly, wherein the electronic assembly comprises the foil, the first structure and the second structure. 
     
     
         4 . The method of  claim 1 , wherein the first structure is at least one of a connector or an electronic component. 
     
     
         5 . The method of  claim 1 , wherein the second structure is at least one of a connector and an electronic component. 
     
     
         6 . The method of  claim 1 , further comprising coupling a second foil to the second structure. 
     
     
         7 . The method of  claim 6 , further comprising writing a third structure to the second foil by depositing conductive material via the direct write manufacturing process to the second foil. 
     
     
         8 . An electronic assembly, comprising:
 a first foil, wherein the first foil is produced from a metal substrate;   a first electrical element deposited via a direct write manufacturing process in a void defined by the first foil, wherein the first electrical element is coupled to a first portion of the first foil; and   a second electrical element deposited via the direct write manufacturing process on a second portion of the first foil.   
     
     
         9 . The electronic assembly of  claim 8 , wherein the first electrical element is in a plane defined by the first foil. 
     
     
         10 . The electronic assembly of  claim 8 , wherein the first foil is shaped to form a surface. 
     
     
         11 . The electronic assembly of  claim 8 , wherein the first electrical element is made of a first material and the second electrical element is made of a second material. 
     
     
         12 . The electronic assembly of  claim 8 , wherein the first electrical element is an electrical component and the second electrical element is a connection. 
     
     
         13 . The electronic assembly of  claim 8 , further comprising a second foil in electronic communication with the first foil, the second foil operatively coupled to the second electrical element. 
     
     
         14 . The electronics assembly of  claim 8 , wherein the first electrical element is made from a conductive ink. 
     
     
         15 . An electrical assembly, comprising:
 a plurality of foils;   a plurality of conductive structures configured to facilitate electronic communication between individual foils of the plurality of foils;   a first conductive structure of the plurality of conductive structures, the first conductive structure coupled to a first foil of the plurality of foils, the first conductive structure deposited in a void defined by the first foil, wherein the first conductive structure is printed with a conductive ink;   a second conductive structure of the plurality of conductive structures, the second conductive structure coupled to the first foil and a second foil;   a third conductive structure of the plurality of conductive structures, the third conductive structure coupled to at least one of the first foil and the second foil, the third conductive structure being an electrical component, wherein the third conductive structure is printed with the conductive ink.   
     
     
         16 . The electrical assembly of  claim 15 , wherein the first conductive surface is substantially within a plane defined by the first foil. 
     
     
         17 . The electrical assembly of  claim 15 , wherein the electrical component is at least one of a resistor, a capacitor, or a switch. 
     
     
         18 . The electrical assembly of  claim 15 , wherein the first foil and the second foil are shaped as surfaces with substantially similar shapes. 
     
     
         19 . The electrical assembly of  claim 15 , wherein the second conductive surface is printed on a conductive structure defined in the first foil. 
     
     
         20 . The electrical assembly of  claim 15 , wherein the first foil and the second foil are copper.