US2016013191A1PendingUtilityA1
Capacitor and method of manufacturing the same
Est. expiryApr 9, 2034(~7.7 yrs left)· nominal 20-yr term from priority
H10P 50/667H10P 50/71H10P 70/15H10P 70/12H10D 1/716H10D 1/696H10D 1/68H01L 28/75H01L 27/10805H10B 12/30H10B 12/03H10B 12/038
40
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Claims
Abstract
A capacitor includes a substrate, a multilayer over the substrate, a plurality of container-shaped storage node structures on the semiconductor substrate and surrounded by the multilayer, the storage node structure has a sidewall extending upwardly from the base to the top, where the sidewall includes an upper segment and a lower segment thinner than the upper segment, a capacitor dielectric material along a surface of each storage node structure, and a capacitor electrode material over the capacitor dielectric material.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A capacitor, comprising:
a substrate; a multilayer over said substrate, wherein said multilayer comprises an isolation layer on said substrate, a stack material layer on said isolation layer, an upper lattice layer on top of said stack material layer, and at least one lower lattice layer in said stack material layer; a plurality of container-shaped storage node structures on said semiconductor substrate and surrounded by said multilayer, said storage node structure having a base, a sidewall extending upwardly from said base to the top of said storage node structure, wherein said sidewall comprises an upper segment and a lower segment thinner than said upper segment; a capacitor dielectric material along a surface of each said storage node structure; and a capacitor electrode material over said capacitor dielectric material, with the capacitor electrode material being capacitively coupled to said storage node structure through said capacitor dielectric material.
2 . The capacitor according to claim 1 , further comprising an implant region under each said storage node structure.
3 . The capacitor according to claim 1 , wherein said at least one lower lattice layer is located between said upper segment and said lower segment.
4 . The capacitor according to claim 1 , wherein the top surface of said storage node structure is coplanar with the top surface of said upper lattice layer.
5 . The capacitor according to claim 1 , wherein the material of said upper lattice layer, said at least one lower lattice layer and said isolation layer comprises silicon nitride.
6 . The capacitor according to claim 1 , wherein the material of said storage node structure comprises titanium nitride.
7 . The capacitor according to claim 1 , wherein the material of said stack material layer comprises poly-silicon.
8 . The capacitor according to claim 1 , wherein the height of said storage node structure is within a range from 15,000 Å to 20,000 Å.
9 . The capacitor according to claim 1 , wherein the thickness of said upper segment is less than or equal to one-half of the thickness of said lower segment.
10 . The capacitor according to claim 1 , wherein the thickness of said upper segment is less than 40 Å.Join the waitlist — get patent alerts
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