Integrated backup band for use in forming an enclosure for a medical device

Abstract

An implantable medical device includes an enclosure having a sidewall and a welded seam in the sidewall, the seam extends along a perimeter of the enclosure. A thermoform is located adjacent a surface of the enclosure and is secured in place within the enclosure. A metalized surface is located adjacent an interior surface of the enclosure sidewall and is secured in place by the thermoform. The metalized surface extends along a perimeter of the enclosure and is configured to obstruct laser energy during a weld seam process. The metalized surface may be provided as a separate backup band component or may be integrated in a perimeter sidewall of the thermoform.

1 . An implantable medical device comprising:
 an enclosure having a sidewall and a welded seam in the sidewall, the seam extending along a perimeter of the enclosure;   a thermoform adjacent a surface of the enclosure and secured in place within the enclosure; and   a metalized surface adjacent an interior surface of the enclosure sidewall and extending along the perimeter of the enclosure, the metalized surface being secured in place by the thermoform and configured to obstruct laser energy.   
     
     
         2 . The device of  claim 1 , wherein the metalized surface is included in a backup band. 
     
     
         3 . The device of  claim 2 , wherein the backup band comprises a perimeter sidewall adjacent the interior surface of the enclosure sidewall, the perimeter sidewall having the metalized surface, and at least one extension extending from the sidewall, the extension being between the thermoform and the surface of the enclosure. 
     
     
         4 . The device of  claim 1 , wherein the thermoform comprises an exterior sidewall adjacent the interior surface of the enclosure sidewall, and the metalized surface is integrated with the exterior sidewall. 
     
     
         5 . The device of  claim 1 , wherein the enclosure is non-planar. 
     
     
         6 . The device of  claim 1 , wherein the metalized surface is non-planar. 
     
     
         7 . The device of  claim 1 , wherein the thermoform is non-planar. 
     
     
         8 . The device of  claim 1 , wherein the thermoform is secured in place by adhesive. 
     
     
         9 . The device of  claim 1 , wherein the thermoform is secured in place by a friction fit between the thermoform and the enclosure. 
     
     
         10 . An implantable medical device comprising:
 an enclosure having a sidewall and a welded seam in the sidewall, the seam extending along a perimeter of the enclosure;   a thermoform adjacent a surface of the enclosure and secured in place within the enclosure; and   a backup band having a perimeter sidewall and at least one extension extending from the sidewall, the perimeter sidewall being adjacent an interior surface of the enclosure sidewall and extending along the perimeter of the enclosure, and the extension being between the thermoform and the surface of the enclosure.   
     
     
         11 . A method of assembling an implantable medical device, said method comprising:
 placing a backup band in a first portion of an enclosure, the back up band having a perimeter sidewall and at least one extension extending from the sidewall, the backup band placed so that an edge of the sidewall extends beyond an edge of a sidewall of the first portion of the enclosure;   placing and securing a thermoform in the first portion of the enclosure so that the at least one extension of the backup band is between the thermoform and a surface of the enclosure;   placing a second portion of the enclosure on the first portion of the enclosure to form a seam between the first portion of the enclosure and the second portion of the enclosure; and   welding the seam to create a hermetic seal.   
     
     
         12 . The method of  claim 11 , wherein the first portion of an enclosure and the second portion of an enclosure are non-planar. 
     
     
         13 . The method of  claim 11 , wherein the backup band is non-planar. 
     
     
         14 . The method of  claim 11 , wherein the thermoform is non-planar. 
     
     
         15 . The method of  claim 11 , wherein the thermoform is secured in place by adhesive. 
     
     
         16 . The method of  claim 10 , wherein the thermoform is secured in place by a friction fit between the thermoform and the enclosure.