Heat channeling and dispersing structure and manufacturing method thereof

Abstract

A heat channeling and dispersing structure includes a substrate, a printed circuit board, and a heat-producing electronic element on the printed circuit board. The printed circuit board is mounted on the substrate, which defines a through hole filled with filler. The electronic element covers the hole infilled with filler. The heat generated by the electronic element is conducted through the filler directly to the substrate for heat dissipation.

What is claimed is: 
     
         1 . A heat dispersion structure, comprising:
 a substrate;   a printed circuit board mounted on the substrate, defining a hole filled with a filler; and   wherein heat generated by an electronic element positioned on the filler is conducted from the filler to the substrate for heat dissipation.   
     
     
         2 . The heat dispersion structure of  claim 1 , wherein the substrate comprises a first surface, the printed circuit board is located on the first surface by a silk-screen printing and sintering process. 
     
     
         3 . The heat dispersion structure of  claim 2 , wherein the substrate is made of aluminum. 
     
     
         4 . The heat dispersion structure of  claim 3 , wherein the substrate further comprises a second surface opposite to the first surface, the first surface is smooth, and the second surface is either smooth or has fins. 
     
     
         5 . The heat dispersion structure of  claim 1 , wherein the printed circuit board comprises a medium layer formed on the first surface, a circuit layer formed on the medium layer, and a protective layer formed on the circuit layer, and the hole passes through the medium layer, the circuit layer, and the protective layer. 
     
     
         6 . The heat dispersion structure of  claim 5 , wherein the circuit layer is formed on the medium layer by a silk-screen printing and sintering process, and the protective layer is formed on the circuit board by a silk-screen printing and sintering process. 
     
     
         7 . The heat dispersion structure of  claim 6 , wherein the electronic element comprises a main body and a wire extending from the main body, the main body is electronically coupled to the printed circuit board  20  via an colloid, and the wire is electronically coupled to the printed layer to couple the electronic element to the printed circuit board. 
     
     
         8 . The heat dispersion structure of  claim 1 , wherein the filler is made of conductive material. 
     
     
         9 . A manufacturing method of the heat dispersion structure, comprising:
 printing a printed circuit board on a substrate;   defining a hole on the printed circuit board;   filling the hole with an filler;   locating an electronic element on the printed circuit board and covering the hole to conduct heat generated by the electronic element from the filler to the substrate for heat dissipation.   
     
     
         10 . The manufacturing method of the heat dispersion structure of  claim 9 , wherein the substrate comprises a first surface, the printed circuit board is located on the first surface by a silk-screen printing and sintering process. 
     
     
         11 . The manufacturing method of the heat dispersion structure of  claim 10 , wherein the substrate is made of aluminum. 
     
     
         12 . The manufacturing method of the heat dispersion structure of  claim 11 , wherein the substrate further comprises a second surface opposite to the first surface, the first surface is smooth, and the second surface is either smooth or has fins. 
     
     
         13 . The manufacturing method of the heat dispersion structure of  claim 9 , wherein the printed circuit board comprises a medium layer formed on the first surface, a circuit layer formed on the medium layer, and a protective layer formed on the circuit layer, and the hole passes through the medium layer, the circuit layer, and the protective layer. 
     
     
         14 . The manufacturing method of the heat dispersion structure of  claim 13 , wherein the circuit layer are formed on the medium layer by a silk-screen printing and sintering process, and the protective layer is formed on the circuit board by a silk-screen printing and sintering process. 
     
     
         15 . The manufacturing method of the heat dispersion structure of  claim 9 , wherein the filler is made of conductive material.