Imaging optical system and projection exposure system for microlithography

Abstract

An imaging optical system includes a plurality of mirrors that image an object field in an object plane into an image field in an image plane. At least one of the mirrors is obscured, and thus has a opening for imaging light to pass through. The fourth-last mirror in the light path before the image field is not obscured and provides, with an outer edge of the optically effective reflection surface thereof, a central shadowing in a pupil plane of the imaging optical system. The distance between the fourth-last mirror and the last mirror along the optical axis is at least 10% of the distance between the object field and the image field. An intermediate image, which is closest to the image plane, is arranged between the last mirror and the image plane. The imaging optical system can have a numerical aperture of 0.9. These measures, not all of which must be effected simultaneously, lead to an imaging optical system with improved imaging properties and/or reduced production costs.

1 . (canceled) 
     
     
         2 . An imaging optical system which during operation directs light along a path to image an object field in an object plane to an image field in an image plane, the imaging optical system comprising:
 fewer than ten mirrors which direct the light along the path,   wherein the imaging optical system is a catoptric optical system having an image fieldside numerical aperture of ≧0.7.   
     
     
         3 . The imaging optical system of  claim 2 , wherein the imaging optical system includes exactly eight mirrors and has an image field-side numerical aperture of 0.9. 
     
     
         4 . The imaging optical system of  claim 2 , wherein:
 the imaging optical system comprises at least six mirrors which direct the light along the path;   at least one of the mirrors includes an opening through which the light passes, and   a fourth-last mirror along the path before the image field does not include an opening and shadows a central portion of a pupil plane of the imaging optical system.   
     
     
         5 . The imaging optical system of  claim 4 , wherein the fourth-last mirror is a convex mirror. 
     
     
         6 . The imaging optical system of  claim 4 , wherein the fourth-last mirror lies on an optical axis of the imaging optical system. 
     
     
         7 . The imaging optical system of  claim 4 , wherein the fourth-last mirror is arranged in the region of a pupil plane of the imaging optical system. 
     
     
         8 . The imaging optical system of  claim 2 , wherein the imaging optical system has a maximum root mean square wavefront error of less than 10 nm. 
     
     
         9 . The imaging optical system of  claim 2 , wherein the imaging optical system has a maximum distortion of less than 10 nm. 
     
     
         10 . The imaging optical system of  claim 2 , wherein the imaging optical system has a pupil obscuration of less than 20%. 
     
     
         11 . The imaging optical system of  claim 2 , wherein the image plane is parallel to the object plane. 
     
     
         12 . The imaging optical system of  claim 2 , wherein the image field is larger than 1 mm 2 . 
     
     
         13 . The imaging optical system of  claim 2 , wherein the image field is a rectangular or arc-shaped image field with a side length of 13 mm. 
     
     
         14 . The imaging optical system of  claim 2 , wherein the imaging optical system has a reduction imaging scale of 8. 
     
     
         15 . The imaging optical system of  claim 2 , wherein an odd number of mirrors of the imaging optical system have an opening through which the light passes. 
     
     
         16 . The imaging optical system of  claim 2 , wherein the imaging optical system images the object field to at least one intermediate image between the object plane and the image plane, and the at least one intermediate image is in a plane that is folded in the vicinity of a pupil plane of the imaging optical system. 
     
     
         17 . The imaging optical system of  claim 2 , wherein principal rays in the path between the object plane and a first of the mirrors in the path extend divergently from neighbouring field points in the object field. 
     
     
         18 . The imaging optical system of  claim 2 , wherein the imaging optical system includes exactly six mirrors, and the imaging optical system images the object field to exactly two intermediate image between the object plane and the image plane. 
     
     
         19 . The imaging optical system of  claim 2 , wherein a third-last mirror and a fifth-last mirror along the path before the image plane both include openings through which the light passes. 
     
     
         20 . A projection exposure system for microlithography comprising:
 a light source;   an illumination optical system; and   the imaging optical system of  claim 2 ,   wherein during operation the light source provides light to the illumination optical system which directs the light to the object field of the imaging optical system.   
     
     
         21 . The projection exposure system of  claim 20 , wherein the light provided by the light source has a wavelength between nm 10 and 30 mm. 
     
     
         22 . A method for producing a microstructured component, the method comprising:
 providing a reticle and a wafer;   using a projection exposure apparatus to project a structure on the reticle onto a lightsensitive layer on the wafer, the projection exposure apparatus comprising an illumination optical system and an imaging optical system according to  claim 2 ; and   producing a microstructure on the wafer based on the structure projected onto the lightsensitive layer.