Electropolishing device and method

Abstract

A device for repositioning a device during an electropolishing process. A fixture is disclosed that is configured to reposition the device during the electropolishing process in order to more evenly electropolish a surface of the device.

What is claimed is: 
     
         1 . A method for electropolishing a device, the method comprising:
 placing a device on an anode, wherein the anode contacts the device at a contact point;   immersing the device in an electrolytic bath;   electropolishing the device while the device is immersed in the electrolytic bath;   repositioning the device during the electropolishing of the device; and   removing the electropolished device from the electrolytic bath.   
     
     
         2 . The method of  claim 1 , wherein repositioning the device during the electropolishing of the device includes repositioning the device of rotationally and/or laterally, wherein repositioning the device exposes the contact point and establishes a new contact point between the anode and the device. 
     
     
         3 . The method of  claim 2 , wherein repositioning the device during the electropolishing of the device occurs manually based on input from a user, automatically, periodically, or any combination thereof. 
     
     
         4 . The method of  claim 1 , wherein repositioning the device during the electropolishing of the device further comprises:
 engaging an outer surface of the device with grips; and   relatively moving the grips to reposition the device.   
     
     
         5 . The method of  claim 1 , wherein the device includes a stent and the grips are insulated. 
     
     
         6 . The method of  claim 1 , wherein repositioning the device during the electropolishing of the device comprises ensuring that the contact point is not repeated as a subsequent contact point. 
     
     
         7 . The method of  claim 4 , wherein the grips only engage the outer surface of the device while repositioning the device. 
     
     
         8 . The method of  claim 1 , wherein the grips include features configured for engaging with the external surface of the device, the features including at least one of teeth, waves, roughness, or texture. 
     
     
         9 . A method for electropolishing a device, the method comprising:
 placing a device on an anode, wherein the anode contacts the device at a contact point;   immersing the device in an electrolytic bath;   electropolishing the device while the device is immersed in the electrolytic bath;   repositioning the device during the electropolishing of the device with a fixture that includes:
 a first grip; and 
 a second grip, wherein the first grip and the second grip are configured to engage an external surface of the device together and to reposition the device by relative movement of the first and second grips; and 
   removing the electropolished device from the electrolytic bath.   
     
     
         10 . The method of  claim 9 , wherein repositioning the device during the electropolishing of the device includes repositioning the device of rotationally and/or laterally, wherein repositioning the device exposes the contact point and establishes a new contact point between the anode and the device. 
     
     
         11 . The method of  claim 10 , wherein repositioning the device during the electropolishing of the device occurs manually based on input from a user, automatically, periodically, or any combination thereof. 
     
     
         12 . The method of  claim 9 , wherein repositioning the device during the electropolishing of the device further comprises:
 engaging an outer surface of the device with grips; and   relatively moving the grips to reposition the device.   
     
     
         13 . The method of  claim 9 , wherein the device includes a stent and the grips are insulated. 
     
     
         14 . The method of  claim 9 , wherein repositioning the device during the electropolishing of the device comprises ensuring that the contact point is not repeated as a subsequent contact point. 
     
     
         15 . The method of  claim 12 , wherein the grips only engage the outer surface of the device while repositioning the device. 
     
     
         16 . A method for electropolishing a device, the method comprising:
 placing a device on an anode, wherein the anode contacts the device at a contact point;   immersing the device in an electrolytic bath;   electropolishing the device while the device is immersed in the electrolytic bath;   moving at least one of a first grip and a second grip relative to the device to reposition the device relative to an electrical contact point with the device; and   removing the electropolished device from the electrolytic bath.   
     
     
         17 . The method of  claim 16 , wherein repositioning the device during the electropolishing of the device includes repositioning the device of rotationally and/or laterally, wherein repositioning the device exposes the contact point and establishes a new contact point between the anode and the device. 
     
     
         18 . The method of  claim 17 , wherein repositioning the device occurs manually based on input from a user, automatically, periodically, or any combination thereof. 
     
     
         19 . The method of  claim 16 , wherein repositioning the device further comprises:
 engaging an outer surface of the device with grips; and   relatively moving the grips to reposition the device.   
     
     
         20 . The method of  claim 16 , wherein the device includes a stent and the grips are insulated.