Electromechanical transducer and method for manufacturing the same
Abstract
The present invention provides a technology for decreasing a dispersion of the performance among electromechanical transducers each having through wiring. A method for manufacturing an electromechanical transducer includes: obtaining a structure in which an insulative portion having a through hole therein is bonded onto an electroconductive substrate; filling the through hole with an electroconductive material to form a through wiring which is electrically connected with the electroconductive substrate; and using the electroconductive substrate as a first electrode, forming a plurality of vibrating membrane portions including a second electrode, which opposes to the first electrode through a plurality of gaps, on an opposite side of the first electrode to the side having the insulative portion, to thereby forming a plurality of cells.
Claims
exact text as granted — not AI-modified1 .- 8 . (canceled)
9 . An electromechanical transducer comprising:
a plurality of cells which are formed by mounting a plurality of vibrating membrane portions including a second electrode, which opposes to a first electrode through a plurality of gaps, on a side of the first electrode of an electroconductive substrate, wherein the first electrode has an insulative portion bonded onto an opposite side of the side having the gaps, and the insulative portion has a through wiring formed therein which is electrically connected to the first electrode.
10 . The electromechanical transducer according to claim 9 , wherein
the first electrode is separated for every element containing at least one cell, and the insulative portion has a plurality of through wirings which are electrically connected to the first electrodes which are separated for every element.
11 . The electromechanical transducer according to claim 9 , wherein the electroconductive substrate is a silicon substrate.
12 . The electromechanical transducer according to claim 9 , wherein the vibrating membrane comprises an SiN film.
13 . The electromechanical transducer according to claim 9 , wherein the insulative portion is composed of a photosensitive resin or a glass material.
14 . The electromechanical transducer according to claim 9 , wherein an ohmic metal is provided between the electroconductive substrate and the through wiring.
15 . The electromechanical transducer according to claim 9 , wherein the through wiring is composed of copper.Join the waitlist — get patent alerts
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