US2016001320A1PendingUtilityA1

Apparatus and method for deposition for organic thin films

Assignee: UNIV MICHIGANPriority: Aug 16, 2007Filed: Sep 10, 2015Published: Jan 7, 2016
Est. expiryAug 16, 2027(~1.1 yrs left)· nominal 20-yr term from priority
H10K 71/40H01L 51/0008B05D 3/002B05D 1/60H10K 71/00C23C 14/228H10K 71/164B05D 7/52C23C 14/12C23C 14/243C23C 14/24H10K 71/16B05D 7/56
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Claims

Abstract

The invention provides apparatus and methods for organic continuum vapor deposition of organic materials on large area substrates.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of depositing an organic thin film onto a substrate, comprising:
 heating an organic material, forming an organic vapor;   transporting the organic vapor in a carrier gas from a heated source cell into a chamber, wherein a back plate of the chamber is heated, the source cell being positioned at the back plate;   heating the chamber sufficiently to form a substantially uniform organic flux of the carrier gas and organic vapor by diffusive mixing of the gas and vapor within the heated chamber;   directing the uniform organic flux to a cooled substrate; and   depositing the organic material onto a surface of the cooled substrate, thereby forming an organic film on the substrate.   
     
     
         2 . The method of  claim 1 , wherein the chamber is heated by supplying heat from all walls of the chamber. 
     
     
         3 . The method according to  claim 1 , wherein the chamber has a length to width ratio of at least about 0.75. 
     
     
         4 . The method according to  claim 1 , wherein the uniform organic flux is a steady state flux. 
     
     
         5 . The method according to  claim 1 , wherein the uniform organic flux is directed to the cooled substrate by a pressure differential. 
     
     
         6 . The method according to  claim 1 , further comprising positioning the source cell, so that the output is aligned with the center of the cooled substrate. 
     
     
         7 . The method according to  claim 1 , further comprising depositing a plurality of organic materials from a plurality of source cells. 
     
     
         8 . The method according to  claim 7 , further comprising depositing the plurality of organic materials successively. 
     
     
         9 . The method according to  claim 7 , further comprising depositing the plurality of organic materials simultaneously. 
     
     
         10 . The method according to  claim 9 , further comprising forming the organic vapors of the organic materials in a series of successive source cells, wherein organic vapor produced in one cell passes through at least one additional source cell. 
     
     
         11 . The method according to  claim 1 , further comprising controlling vapor flow from the source cell with a valve within a source cell. 
     
     
         12 . The method according to  claim 1 , further comprising controlling vapor flow from a source cell by moving a stopper relative to an opening in the source cell, wherein the stopper has a shape that corresponds to that of the opening, and stops the vapor flow when the stopper is moved fully into the opening. 
     
     
         13 . The method according to  claim 12 , further comprising opening a bypass line when the opening of the source cell is closed by the stopper. 
     
     
         14 . The method according to  claim 1 , further comprising maintaining the cooled substrate at a temperature sufficiently low to reduce the organic material concentration in a region directly above the surface of the cooled substrate to a concentration substantially less than the organic material concentration in the rest of the heated chamber. 
     
     
         15 . The method according to  claim 1 , further comprising maintaining a flow rate of the organic vapor and carrier gas sufficient to maintain the organic vapor in the heated chamber at a substantially uniform concentration other than in the region directly above the surface of the cooled substrate.

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