Metallized film-over-foam contacts

Abstract

A contact suitable for circuit grounding of surface mount technology devices generally includes a resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.

What is claimed is: 
     
         1 . A contact for circuit grounding of surface mount technology devices, the contact comprising:
 a resilient core member;   a solderable electrically conductive layer including a metallized film; and   an adhesive bonding the solderable electrically conductive layer to the resilient core member, the adhesive having no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens;   whereby the contact is solderable to a surface of a printed circuit board.   
     
     
         2 . The contact of  claim 1 , wherein:
 the resilient core member comprises foam;   the solderable electrically conductive layer includes a metallized polyimide film;   the contact has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens; and   the contact has a flame rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94.   
     
     
         3 . The contact of  claim 2 , wherein the contact is able to withstand solder reflow conditions and temperatures up to at least about 280 degrees Celsius and maintain operational structural integrity following a solder reflow operation. 
     
     
         4 . The contact of  claim 1 , wherein the contact has a flame rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94. 
     
     
         5 . The contact of  claim 1 , wherein the contact has a flame rating of V-1, V-2, or HB under Underwriter's Laboratories (UL) Standard No. 94. 
     
     
         6 . The contact of  claim 1 , wherein the solderable electrically conductive layer includes a metallized polyimide film. 
     
     
         7 . The contact of  claim 1 , wherein the contact has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens. 
     
     
         8 . The contact of  claim 1 , wherein the contact is able to withstand solder reflow conditions and temperatures and maintain operational structural integrity following a solder reflow operation. 
     
     
         9 . A halogen-free contact for circuit grounding of surface mount technology devices, the contact comprising:
 a resilient core member;   a metal composition film surrounding at least part of the resilient core member and that is solderable; and   an adhesive bonding the metal composition film to the resilient core member;   wherein the resilient core member, the metal composition film, and the adhesive combined have no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens such that the contact is halogen free; and   wherein the contact has a flame rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94;   whereby the contact is solderable to a surface of a printed circuit board.   
     
     
         10 . The contact of  claim 9 , wherein:
 the resilient core member comprises foam;   the metal composition film includes a metallized polyimide film; and   the contact is able to withstand solder reflow conditions and temperatures up to at least about 280 degrees Celsius and maintain operational structural integrity following a solder reflow operation.   
     
     
         11 . The contact of  claim 10 , wherein the foam comprises silicone foam, and/or wherein the foam has a density of about 15 pounds per cubic foot or more. 
     
     
         12 . The contact of  claim 9 , wherein the metal composition film includes a metallized polyimide film. 
     
     
         13 . The contact of  claim 9 , wherein the contact is able to withstand solder reflow conditions and temperatures and maintain operational structural integrity following a solder reflow operation. 
     
     
         14 . A method of installing a flame retardant, halogen free contact to a surface of a printed circuit board, the contact including a resilient core and a metallized film surrounding at least part of the resilient core, the method comprising soldering the metallized film of the halogen free contact to a surface of a printed circuit board, whereby an electrical pathway is established from the printed circuit board to the contact through the metallized film, wherein the contact has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens. 
     
     
         15 . The method of  claim 14 , wherein:
 the resilient core comprises foam;   the metallized film includes a metallized polyimide film; and   the contact has a flame rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94.   
     
     
         16 . The method of  claim 14 , further comprising placing the contact using a surface mount technology machine onto a ground trace of the printed circuit board, wherein the ground trace is pre-screened with solder paste. 
     
     
         17 . The method of  claim 14 , further comprising performing a solder reflow operation while the contact is on the solder paste to thereby solder the contact to the ground trace of the printed circuit board. 
     
     
         18 . The method of  claim 14 , wherein the contact has a flame rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94. 
     
     
         19 . The method of  claim 14 , wherein the contact has a flame rating of V-1, V-2, or HB under Underwriter's Laboratories (UL) Standard No. 94. 
     
     
         20 . The method of  claim 14 , wherein the contact is able to withstand solder reflow conditions and temperatures and maintain operational structural integrity following a solder reflow operation.