US2015380512A1PendingUtilityA1
Metal gate structure and manufacturing method thereof
Assignee: UNITED MICROELECTRONICS CORPPriority: Mar 1, 2011Filed: Sep 9, 2015Published: Dec 31, 2015
Est. expiryMar 1, 2031(~4.6 yrs left)· nominal 20-yr term from priority
Inventors:Chan-Lon YangChi-Mao HsuChun-Yuan WuTzyy-Ming ChengShih-Fang TzouChin-Fu LinHsin-Fu HuangMin-Chuan Tsai
H10D 64/01318H10D 62/822H10D 62/021H10D 30/792H10D 30/0212H10D 64/667H10D 64/518H10D 64/514H10D 64/017H10D 30/601H10D 30/0227H10D 64/691H01L 29/4966H01L 29/42376H01L 29/517H01L 29/42364H10D 64/669
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Claims
Abstract
A method for manufacturing a metal gate structure includes providing a substrate having a high-K gate dielectric layer and a bottom barrier layer sequentially formed thereon, forming a work function metal layer on the substrate, and performing an anneal treatment to the work function metal layer in-situ.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A metal gate structure comprising:
a high-K gate dielectric layer; a bottom barrier layer formed on the high-K gate dielectric layer; a titanium tri-aluminide (TiAl 3 ) work function metal layer formed on the bottom barrier layer; a top barrier layer formed on the TiAl 3 layer; and a low-resistance metal layer formed on the top barrier layer.
2 . The metal gate structure according to claim 1 , wherein the bottom barrier layer comprises titanium nitride (TiN).
3 . The metal gate structure according to claim 1 , wherein the bottom barrier layer comprises titanium nitride or tantalum nitride (TaN).
4 . The metal gate structure according to claim 1 , wherein the top barrier layer comprises titanium nitride or titanium oxynitride (TiON).
5 . The metal gate structure according to claim 1 , wherein the high-K gate dielectric layer comprises materials selected from the group consisting of hafnium oxide (HfO 2 ), hafnium silicon oxide (HfSiO 4 ), hafnium silicon oxynitride (HfSiON), aluminum oxide (Al 2 O 3 ), lanthanum oxide (La 2 O 3 ), tantalum oxide (Ta 2 O 5 ), yttrium oxide (Y 2 O 3 ), zirconium oxide (ZrO 2 ), strontium titanate oxide (SrTiO 3 ), zirconium silicon oxide (ZrSiO 4 ), and hafnium zirconium oxide (HfZrO 4 ).
6 . The metal gate structure according to claim 1 , wherein the low-resistance metal layer comprises aluminum (Al).
7 . The metal gate structure according to claim 1 , wherein cross-sectional views of the high-K gate dielectric layer, the bottom barrier layer, the TiAl 3 layer, and the top barrier layer comprise a U-shape.
8 . The metal gate structure according to claim 1 , wherein cross-sectional views of the TiAl 3 layer and the top barrier layer comprise a U-shape.Join the waitlist — get patent alerts
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