Patterned pressure-sensitive adhesive body and producing method thereof
Abstract
A patterned pressure-sensitive adhesive body obtained by a method for producing a patterned pressure-sensitive adhesive body including a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a first slit in a pattern shape and an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second slit in an outer frame shape surrounding the pattern shape, wherein the second slit has a discontinuous portion in a cutting direction.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A patterned pressure-sensitive adhesive body obtained by a method for producing a patterned pressure-sensitive adhesive body comprising:
a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a first slit in a pattern shape and an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second slit in an outer frame shape surrounding the pattern shape, wherein the second slit has a discontinuous portion in a cutting direction.Join the waitlist — get patent alerts
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