US2015373783A1PendingUtilityA1

Placing table and plasma processing apparatus

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Assignee: TOKYO ELECTRON LTDPriority: Jun 24, 2014Filed: Jun 4, 2015Published: Dec 24, 2015
Est. expiryJun 24, 2034(~7.9 yrs left)· nominal 20-yr term from priority
Inventors:Dai Kitagawa
H10P 72/7616H10P 72/0434H10P 72/0432H10P 72/72H01J 37/32724H05B 3/262H01J 37/32532H01J 37/32715H05B 3/26H01L 21/67103H01L 21/67069H01L 21/6831H01J 37/32082H01J 37/32642
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Claims

Abstract

Provided is a placing table configured to place a workpiece thereon. The placing table includes: an electrostatic chuck configured to attract the workpiece; a support member configured to support a focus ring; and a metal base having a first region configured to support the electrostatic chuck and a second region configured to support the support member, the second region surrounding the first region. The support member includes: an intermediate layer formed of a ceramic sintered compact and supported on the second region via an adhesive; a thermally sprayed ceramic layer formed on the intermediate layer by a thermal spraying method; and a heater electrode provided within the thermally sprayed ceramic layer. The heater electrode is formed by the thermal spraying method.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A placing table configured to place a workpiece thereon, the placing table comprising:
 an electrostatic chuck configured to attract the workpiece;   a support member configured to support a focus ring; and   a metal base having a first region configured to support the electrostatic chuck and a second region configured to support the support member, the second region surrounding the first region, wherein the support member includes:   an intermediate layer formed of a ceramic sintered compact and supported on the second region via an adhesive;   a thermally sprayed ceramic layer formed on the intermediate layer by a thermal spraying method; and   a heater electrode provided within the thermally sprayed ceramic layer, the heater electrode being formed by the thermal spraying method.   
     
     
         2 . The placing table according to  claim 1 , wherein the first region and the second region are divided by a groove that extends in an annular shape between the first region and the second region. 
     
     
         3 . The placing table according to  claim 1 , wherein a power feeding contact electrically connected to the heater electrode is provided in the intermediate layer, and the power feeding contact is formed of a conductive ceramic material. 
     
     
         4 . The placing table according to  claim 1 , wherein the thermally sprayed ceramic layer includes a zirconia film formed between the heater electrode and the intermediate layer by the thermal spraying method. 
     
     
         5 . A plasma processing apparatus comprising the placing table defined in  claim 1 .

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