Chemical mechanical polishing conditioner

Abstract

Provided is a CMP conditioner comprising: a substrate comprising multiple concave parts, the concave parts formed in a surface of the substrate and each concave part having a side wall; multiple fixed plates, each fixed plate comprising a bottom, a top, a concavity and an inclined plane, the bottom fixed into the concave part, the top integrated with the bottom with a contact surface formed between the top and the bottom, the concavity formed in the top and opposite the bottom, the inclined plane formed between the contact surface and the concavity, an angle and a space formed between the inclined plane and the side wall; and multiple abrasive units, each abrasive unit mounted in the concavity. When the CMP conditioner is applied to a pad, the thickness of the pad can recover to its original thickness; i.e., the cutting depth is increased to improve the dressing performance.

What is claimed is: 
     
         1 . A chemical mechanical polishing conditioner comprising:
 a substrate comprising multiple concave parts, the concave parts formed in a surface of the substrate, and each concave part having a side wall;   multiple fixed plates, each fixed plate comprising a bottom, a top, a concavity and an inclined plane, the bottom fixed into the concave part, the top formed on the bottom in an integral configuration with a contact surface formed between the top and the bottom, the concavity formed in the top and opposite the bottom, the inclined plane formed between the contact surface and the concavity, a space formed between the inclined plane and the side wall, an angle formed between the inclined plane and the side wall, the angle ranging from 30° to 60°, inclusive; and   multiple abrasive units, each abrasive unit mounted in the concavity.   
     
     
         2 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein each fixed plate is fixed into the concave part through a binding layer, the binding layer is consisted of a ceramic material, a brazing material, an electroplating material, a metallic material, or a polymeric material. 
     
     
         3 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein each fixed plate is fixed into the concave part through a binding layer, the binding layer is selected from the group consisting of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, and any combination thereof. 
     
     
         4 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein each fixed plate is fixed into the concave part through a binding layer, the binding layer is consisted of epoxy resin, polyester resin, polyacrylate resin, or phenol resin. 
     
     
         5 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein the concave parts are arranged on the surface of the substrate in concentric circles. 
     
     
         6 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein each abrasive unit has a tip opposite the concavity, and a vertical distance between the surface of the substrate and the tip of each abrasive unit ranges from 20 μm to 300 μm, inclusive. 
     
     
         7 . The chemical mechanical polishing conditioner as claimed in  claim 6 , wherein the vertical distance between the surface of the substrate and the tip of each abrasive unit ranges from 100 μm to 300 μm, inclusive. 
     
     
         8 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein the chemical mechanical polishing conditioner has at least two vertical distances between the surface of the substrate and the tip of each abrasive unit, a difference between the vertical distances ranges from 20 μm to 100 μm, inclusive. 
     
     
         9 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein a cutting angle of each abrasive unit ranges from 30° to 150°, inclusive. 
     
     
         10 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein a crystal structure of each abrasive unit is hexahedral or octahedral. 
     
     
         11 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein the concave parts are formed through the substrate.