Semiconductor device with covering member that partially covers wiring substrate

Abstract

An error is prevented from being generated at a mounting position of an electronic component on a wiring substrate. A first semiconductor chip has a main surface and a rear surface. The rear surface is an opposite surface of the main surface. The rear surface of the first semiconductor chip is an opposite surface of the main surface thereof. A wiring substrate is rectangular, and has a main surface and a rear surface. The first semiconductor chip is mounted on the main surface of the wiring substrate. A lid covers the main surface of the wiring substrate, and the first semiconductor chip. An electronic component is mounted on the rear surface of the wiring substrate. The main surface of the wiring substrate has uncovered regions that are not covered with the lid at at least two corners facing each other.

What is claimed is: 
     
         1 . A semiconductor device, comprising:
 a substrate including a semiconductor chip;   a covering member that covers a first surface of the substrate and the semiconductor chip, the covering member including a first portion, a second portion and an third portion, the third portion is mounted to the substrate and the second portion connects the first portion to the third portion; and   an electronic component that is mounted on a second surface of the substrate,   wherein the first surface of the substrate includes a region that is not covered by the covering member.   
     
     
         2 . The semiconductor device according to  claim 1 , wherein the third portion extends in a first direction and the second portion extends in a second direction that intersects with the first direction. 
     
     
         3 . The semiconductor device according to  claim 2 , wherein the first portion extends in the first direction. 
     
     
         4 . The semiconductor device according to  claim 2 , wherein the third portion has a length in the first direction that is less than a length of the first portion in the first direction. 
     
     
         5 . The semiconductor device according to  claim 2 , wherein the third portion includes a first surface and a second surface, the first surface of the third portion is longer than the second surface of the third portion. 
     
     
         6 . The semiconductor device according to  claim 5 , wherein the first surface of the third portion is longer in the first direction than the second surface of the third portion in the first direction. 
     
     
         7 . The semiconductor device according to  claim 2 , wherein the first portion includes a first surface and a second surface, the first surface of the first portion is longer than the second surface of the first portion. 
     
     
         8 . The semiconductor device according to  claim 7 , wherein the first surface of the first portion is longer in the first direction than the second surface of the first portion in the first direction. 
     
     
         9 . The semiconductor device according to  claim 1 , wherein the second portion is sloped between the third portion and the first portion. 
     
     
         10 . The semiconductor device according to  claim 1 , wherein the uncovered region is provided at an edge of the substrate. 
     
     
         11 . The semiconductor device according to  claim 1 , wherein the uncovered region is provided at a corner the substrate. 
     
     
         12 . The semiconductor device according to  claim 1 , wherein each corner of the substrate is not covered by the covering member. 
     
     
         13 . The semiconductor device according to  claim 1 , wherein the covering member includes a notch that overlaps with a corner of the substrate. 
     
     
         14 . The semiconductor device according to  claim 1 , wherein a width of a portion of the uncovered region that overlaps with a diagonal line of the wiring substrate is greater than or equal to 1 mm, and less than or equal to 6 mm. 
     
     
         15 . The semiconductor device according to  claim 1 , wherein the covering member contacts the semiconductor chip. 
     
     
         16 . The semiconductor device according to  claim 1 , wherein the third portion includes a plurality of sides at least two of which are fixed to the substrate. 
     
     
         17 . The semiconductor device according to  claim 1 , wherein the third portion includes a plurality of sides, wherein at least one of the sides is fixed to the substrate and at least one of the sides is not fixed to the substrate.