Through-plate microchannel transfer devices

Abstract

The present disclosure concerns embodiments of a microfluidic transfer device. The device mitigates risk of cross contamination between working fluids and is amenable to high-volume, low-cost manufacturing techniques. The device may be configured for mass transfer, heat transfer, or both. For instance, certain disclosed embodiments incorporate semi-permeable membranes to transfer target substances from one fluid to another. Moreover, the device may incorporate both heat and mass transfer components.

We claim: 
     
         1 . A heat transfer device comprising:
 a first plate;   a second plate;   a first fluid inlet;   a first fluid outlet;   a second fluid inlet;   a second fluid outlet;   a plurality of laminae disposed between the first plate and the second plate;   a plurality of microchannels formed in each lamina, the microchannels of a first subset of the laminae communicating with the first fluid inlet and the first fluid outlet, the microchannels of a second subset of the laminae communicating with the second fluid inlet and the second fluid outlet; and   a heat conductive transfer material disposed between microchannels of a lamina of the first subset of laminae and microchannels of the second subset of the laminae.   
     
     
         2 . The heat transfer device of  claim 1  wherein the laminae are compressed between the first plate and the second plate. 
     
     
         3 . The heat transfer device of  claim 1  wherein the microchannels have a depth of less than 1000 μm. 
     
     
         4 . The heat transfer device of  claim 1  wherein the laminae are 250 μm to 1000 μm thick. 
     
     
         5 . The heat transfer device of  claim 1  wherein the laminae comprise a metal material. 
     
     
         6 . The heat transfer device of  claim 1  wherein the microchannels in each lamina are disposed in parallel arrangement.