Heat removal assembly

Abstract

A heat removal assembly is provided herein. The heat removal assembly includes an evaporator block, a heat pipe, and a condenser plate. The evaporator block removes heat from an electronic component. The evaporator block engages with the electronic component and forms a thermal connection therebetween that removes the heat from the electronic component. The heat pipe connects to the evaporator block to remove heat from the evaporator block. The condenser plate connects to the heat pipe and receives heat from the heat pipe. The condenser plate includes a thermal mating surface that mates with a thermal member, such that the heat is removed from the assembly via the thermal mating surface.

What is claimed is: 
     
         1 . A heat removal assembly comprising:
 an evaporator block to remove heat from an electronic component, the evaporator block to engage with the electronic component and form a thermal connection therebetween that removes heat from the electronic component;   a heat pipe connects to the evaporator block to remove heat from the evaporator block;   a condenser plate connects to the heat pipe to receive heat from the heat pipe, the condenser plate including a thermal mating surface that mates with a thermal member, such that the heat is removed from the assembly via the thermal mating surface.   
     
     
         2 . The assembly of  claim 1 , wherein the thermal mating surface lies flush with a receiving surface of the thermal member. 
     
     
         3 . The assembly of  claim 1 , wherein the evaporator block further comprises an evaporator thermal surface that lies flush with a portion of the electronic component to remove heat therefrom. 
     
     
         4 . The assembly of  claim 1 , wherein the condenser plate comprises a first plate and a second plate, the first plate including a first thermal mating surface and the second plate including a second thermal mating surface, the first plate and the second plate aligned such that the first thermal mating surface and the second thermal mating surface mate with the thermal member. 
     
     
         5 . The assembly of  claim 4 , further comprising an alignment member formed in the condenser plate to align the first plate and the second plate such that the first thermal mating surface and the second thermal mating surface mate with the thermal member. 
     
     
         6 . The assembly of  claim 1 , wherein the heat pipe includes a first portion, a second portion, and a bellow therebetween, the first portion connects to the condenser plate, the bellow enables the second portion of the heat pipe to pivot with reference to the first portion of the heat pipe. 
     
     
         7 . The assembly of  claim 1 , wherein the heat pipe pivotally connects to the condenser plate, the heat pipe and the condenser plate provides a thermal connection that transfers the heat from the heat pipe to the condenser plate. 
     
     
         8 . A system to remove heat comprising:
 an electronic component; and   a heat removal assembly including:
 an evaporator block to remove heat from the electronic component, the evaporator block to engage with the electronic component and form a thermal connection therebetween that removes heat from the electronic component; 
 a heat pipe connects to the evaporator block to remove heat from the evaporator block; and 
 a condenser plate connects to the heat pipe to receive heat from the heat pipe, the condenser plate including a thermal mating surface that aligns with a thermal member, such that the heat is removed from the assembly via the thermal mating surface. 
   
     
     
         9 . The system of  claim 8 , wherein:
 the thermal mating surface lies flush with a receiving surface of the thermal member; and   the evaporator block further comprises an evaporator thermal surface that lies flush with a portion of the electronic component to remove heat therefrom.   
     
     
         10 . The system of  claim 8 , wherein the condenser plate comprises a first plate and a second plate, the first plate including a first thermal mating surface and the second plate including a second thermal mating surface, the first plate and the second plate aligned such that the first thermal mating surface and the second thermal mating surface aligns with the thermal member. 
     
     
         11 . The system of  claim 10 , further comprising an alignment member formed between the first and second portion of the condenser plate to align the first plate and the second plate of the condenser plate, such that
 the first thermal mating surface and the second thermal mating surface align with the thermal member, and   the first thermal mating surface and the second thermal mating surface provide a thermal connection that transfers the heat from the heat pipe to the condenser plate.   
     
     
         12 . The system of  claim 11 , wherein the alignment member comprises a pin that fits into an aperture formed between the first plate and the second plate of the condenser plate. 
     
     
         13 . The system of  claim 8 , wherein
 the heat pipe comprises a first heat pipe and a second heat pipe; and   the evaporator block comprises a first and second evaporator block,
 the first heat pipe connects to the first evaporator block and the second heat pipe connects to the second evaporator block, 
 the second heat pipe including a first portion, a second portion, and a bellow therebetween, the first portion of the second heat pipe connects to the condenser plate, the bellow enables the second portion of the second heat pipe to pivot with reference to the first portion of the second heat pipe and maintain a thermal connection therebetween. 
   
     
     
         14 . The system of  claim 8 , wherein
 the heat pipe comprises a first heat pipe and a second heat pipe; and   the evaporator block comprises a first and second evaporator block,
 the first heat pipe connects to the first evaporator block and the second heat pipe connects to the second evaporator block, 
 the second heat pipe hingedly connects to the condenser plate such that the second heat pipe:
 rotates the second evaporator block into and out of alignment with the electronic component, and provides a thermal connection between the second heat pipe and the condenser plate. 
 
   
     
     
         15 . A heat removal assembly comprising:
 a first evaporator block to remove heat from a first surface of an electronic component, the first evaporator block to engage with the first surface of the electronic component and form a first thermal connection therebetween that removes heat from the electronic component;   a first heat pipe connects to the first evaporator block to remove heat therefrom;   a second evaporator block to remove heat from a second surface of the electronic component, the second evaporator block to engage with the electronic component and form a second thermal connection therebetween that removes heat from the electronic component;   a second heat pipe connects to the second evaporator block to remove heat therefrom; and   a condenser plate connects to the first heat pipe and the second heat pipe to receive heat therefrom, the condenser plate including a thermal mating surface that mates with a thermal member, such that the heat is removed from the assembly via the thermal mating surface.