Semiconductor integrated circuit device, electronic device, and radio communication device

Abstract

In an embodiment, a semiconductor integrated circuit device includes a driver circuit that drives a transmission line, an output terminal coupled to the output of the driver circuit, and a variable-impedance circuit. The variable-impedance circuit is coupled, for example, between the driver circuit and the output terminals for series-termination of the transmission line.

1 - 14 . (canceled) 
     
     
         15 . A radio communication device, comprising:
 a radio frequency IC for processing radio frequency signals;   a base band IC for processing base band signals, coupled to the radio frequency IC;   an application processor IC including a driver circuit and a system state control unit, said application processor IC coupled to the base band IC;   a first peripheral device coupled to the driver circuit via a first transmission line and being controlled by the driver circuit;   a second peripheral device coupled to the driver circuit via a second transmission line and being controlled by the driver circuit; and   a power management IC controlled by the system state control unit and configured to control a power supply to the first and second peripheral devices,   wherein the driver circuit and the first transmission line are coupled via a variable-impedance circuit,   wherein the driver circuit and the second transmission line are coupled via the variable-impedance circuit, and   wherein the system state control unit is configured to adjust an impedance value of the variable-impedance circuit depending on a state of the power supply to the first and second peripheral devices.   
     
     
         16 . The semiconductor device according to  claim 15 ,
 wherein the variable-impedance circuit is configured to match impedances between the driver circuit and the first and second peripheral devices.   
     
     
         17 . The semiconductor device according to  claim 15 , wherein the first and second peripheral devices are camera devices. 
     
     
         18 . A radio communication device comprising:
 a radio frequency IC for processing radio frequency signals;   a base band IC for processing base band signals, coupled to the radio frequency IC;   an application processor IC including a driver circuit and a system state control unit, said application process IC coupled to the base band IC;   a first peripheral device coupled to the driver circuit via a first transmission line and being controlled by the driver circuit;   a second peripheral device coupled to the driver circuit via a second transmission line and being controlled by the driver circuit; and   a power management IC controlled by the system state control unit and configured to control a power supply to the first and second peripheral devices,   wherein the first peripheral device and the first transmission line are coupled via a first variable-impedance circuit,   wherein the second peripheral and the second transmission line are coupled via a second variable-impedance circuit, and   wherein the system state control unit is configured to adjust impedance values of the first and second variable-impedance circuits depending on a state of the power supply to the first and second peripheral devices.   
     
     
         19 . The semiconductor device according to  claim 18 ,
 wherein the first variable-impedance circuit is configured to match an impedance between the driver circuit and the first peripheral device, and   wherein the second variable-impedance circuit is configured to match an impedance between the driver circuit and the second peripheral device.   
     
     
         20 . The semiconductor device according to  claim 18 , wherein the first and second peripheral devices are camera devices.