Heat-dissipation film

Abstract

The invention provides a heat-dissipation film, belonging to the technical field of heat-dissipation, which can solve the problem that the heat-dissipation film in the prior art dissipates heat in a single heat-dissipation way, and the heat-dissipation effect thereof is not good in the case that much heat or a fire source exists. The heat-dissipation film of the invention includes a first heat-dissipation sheet and an endothermic reaction module; wherein one surface of the first heat-dissipation sheet is in contact with a heating object, and the other surface of the first heat-dissipation is attached to the endothermic reaction module for absorbing heat generated by the heating object. The invention can improve the heat-dissipation effect of the heat-dissipation film.

1 . A heat-dissipation film, including a first heat-dissipation sheet and an endothermic reaction module disposed on the first heat-dissipation sheet, or including a first heat-dissipation sheet and a second heat-dissipation sheet which are disposed opposite to each other with a spacing therebetween, and an endothermic reaction module disposed between the first heat-dissipation sheet and the second heat-dissipation sheet, wherein
 one surface of the first heat-dissipation sheet is in contact with a heating object, and the other surface of the first heat-dissipation sheet is attached to the endothermic reaction module for absorbing heat generated by the heating object.   
     
     
         2 . The heat-dissipation film of  claim 1 , wherein the first heat-dissipation sheet is attached to the endothermic reaction module by thermal conductive adhesive. 
     
     
         3 . The heat-dissipation film of  claim 1  wherein the endothermic reaction module includes at least one accommodating chamber which accommodates endothermic reaction material. 
     
     
         4 . The heat-dissipation film of  claim 3 , wherein the endothermic reaction  material includes a material, endothermic chemical reaction of which is reversible, and the material includes sodium bicarbonate or five hydrated copper sulfate. 
     
     
         5 . The heat-dissipation film of  claim 3 , wherein the endothermic reaction module includes one discharging conduit and one accommodating chamber, and reactant generated by reaction of the endothermic reaction material is discharged outside the heat-dissipation film via the discharging conduit. 
     
     
         6 . The heat-dissipation film of  claim 3 , wherein the endothermic reaction module includes one discharging conduit, a plurality of accommodating chambers and a plurality of heat-resistant conduits, and
 every two adjacent accommodating chambers communicate with each other via one heat-resistant conduit, and one of the plurality of accommodating chambers is connected to the discharging conduit for discharging reactant generated by reaction of the endothermic reaction material outside the heat-dissipation film.   
     
     
         7 . The heat-dissipation film of  claim 6 , wherein the heat-resistant conduit is made of metal. 
     
     
         8 . The heat-dissipation film of  claim 7 , wherein the metal includes one or more selecting from a group consisting of copper, aluminum, and silver. 
     
     
         9 . The heat-dissipation film of  claim 5 , wherein the discharging conduit is made of metal. 
     
     
         10 . The heat-dissipation film of  claim 9 , wherein the metal includes one or more selecting from a group consisting of copper, aluminum, and silver. 
     
     
         11 . The heat-dissipation film of  claim 6 , wherein the discharging conduit is made of metal. 
     
     
         12 . The heat-dissipation film of  claim 11 , wherein the metal includes one or more selecting from a group consisting of copper, aluminum, and silver. 
     
     
         13 . The heat-dissipation film of  claim 3 , wherein the first heat-dissipation sheet and the accommodating chamber are made of any one selecting from a group consisting of metal, graphite film and grapheme. 
     
     
         14 . The heat-dissipation film of  claim 13 , wherein the metal includes one or more selecting from a group consisting of copper, aluminum, and silver. 
     
     
         15 . The heat-dissipation film of  claim 1 , including a first heat-dissipation sheet and a second heat-dissipation sheet which are disposed opposite to each other with a spacing therebetween, and an endothermic reaction module disposed between the first heat-dissipation sheet and the second heat-dissipation sheet, wherein the endothermic reaction module is attached to the second heat-dissipation sheet by thermal conductive adhesive. 
     
     
         16 . The heat-dissipation film of  claim 3 , including a first heat-dissipation sheet and a second heat-dissipation sheet winch are disposed opposite to each other with a spacing therebetween, and an endothermic reaction module disposed between the first heat-dissipation sheet and the second heat-dissipation sheet, wherein the first heat-dissipation sheet, the second heat-dissipation sheet and the accommodating chamber are made of any one selecting from a group consisting of metal, graphite film and graphene. 
     
     
         17 . The heat-dissipation film of  claim 16 , wherein the metal includes one or more selecting from a group consisting of copper, aluminum, and silver. 
     
     
         18 . The heat-dissipation film of  claim 5 , wherein the endothermic reaction material includes a material, endothermic chemical reaction of which is reversible, and the material includes sodium bicarbonate or five hydrated copper sulfate. 
     
     
         19 . The heat-dissipation film of  claim 6 , wherein the endothermic reaction material includes a material, endothermic chemical reaction of which is reversible, and the material includes sodium bicarbonate or five hydrated copper sulfate.