Processing disk for processing a substrate

Abstract

A processing disk ( 10 ) for processing a substrate ( 22 ), including a carrying body ( 11 ) having an accommodation region ( 13 ) and a processing region ( 14 ) and including a processing section ( 17 ) having one or more segments ( 12 ) that are connected to a connection region ( 24 ) of the carrying body ( 11 ), wherein a cooling opening ( 25 ) is provided in at least one segment ( 12 ) and/or in at least one connection region ( 24 ) of the carrying body ( 11 ) for a segment ( 12 ).

What is claimed is: 
     
         1 - 11 . (canceled) 
     
     
         12 . A processing disk for processing a substrate comprising:
 a support body including a reception region and a processing region; and   a processing section including one or multiple segments, the segments being connected to a connection region of the support body, a cooling opening being provided at least partially in at least one segment or in at least one connection region of the support body to a segment.   
     
     
         13 . The processing disk as recited in  claim 12  wherein the cooling opening is provided completely in the at least one segmentor or in the at least one connection region of the support body. 
     
     
         14 . The processing disk as recited in  claim 12  wherein the cooling opening is formed in the support body. 
     
     
         15 . The processing disk as recited in  claim 14  wherein the cooling opening in the support body is designed as a through opening. 
     
     
         16 . The processing disk as recited in  claim 14  wherein the cooling opening in the support body is designed as a blind opening. 
     
     
         17 . The processing disk as recited in  claim 14  wherein the cooling opening is formed in the support body and in the segment. 
     
     
         18 . The processing disk as recited in  claim 17  wherein the cooling opening is designed as a through opening in the support body and as a through opening in the segment. 
     
     
         19 . The processing disk as recited in  claim 17  wherein the cooling opening is designed as a through opening in the support body and as a blind opening in the segment. 
     
     
         20 . The processing disk as recited in  claim 12  wherein the cooling opening is designed as a through opening in the segment. 
     
     
         21 . The processing disk as recited in  claim 12  wherein the cooling opening amounts to up to 80% of the cross-sectional area of the segments. 
     
     
         22 . The processing disk as recited in  claim 12  wherein the cooling opening is filled with a heat conducting material, the heat conductivity of the material being higher than the heat conductivity of the support body.