US2015325858A1PendingUtilityA1
Methods and system for manufacturing lead battery plates
Est. expiryNov 7, 2028(~2.3 yrs left)· nominal 20-yr term from priority
B21C 23/005H01M 4/82B21C 29/003H01M 4/685C22F 1/12C22C 11/00Y02E60/10B21C 31/00B21C 23/085B21C 23/002
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Claims
Abstract
Methods and a system for manufacturing a lead or lead alloy plate lattice for a lead-acid battery are described, comprising continuous extrusion of a melt of lead or lead alloy under temperatures lower by 10-100° C. than the melting point of lead, or the lead alloy, the extrudate being subsequently subjected to a flattening process under a temperature lower by more than at least 230° C. than the melting point of lead or the lead alloy, with a total draft rate less than 10%, and thereafter the extrudate may be processed so as to manufacture a plate lattice.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing a lead, or lead alloy, plate lattice for a lead-acid battery, comprising:
continuously extruding the lead, or lead alloy, under temperatures lower by 10 to 100° C. than the melting point of the lead, or the lead alloy, flattening of an extrudate thus formed under a temperature lower by more than at least 267° C. than the melting point of the lead or the lead alloy, wherein said flattening of said extrudate provides a total draft rate less than 10%, and processing the extrudate so as to manufacture the plate lattice, wherein a cathode lead or lead alloy plate is manufactured, and wherein cooling of the extrudate is controlled to provide a grain size of said plate of 10-50 μm.
2 . The method according to claim 1 , wherein said flattening is performed under a temperature lower by more than at least 287° C. below the melting point of lead or the lead alloy.
3 . The method according to claim 1 , wherein said flattening is performed under a temperature lower by more than at least 297° C. below the melting point of lead or the lead alloy.
4 . The method according to claim 1 , wherein said flattening is performed under a temperature lower by more than at least 307° C. below the melting point of lead or the lead alloy.
5 . The method according to claim 1 , wherein said flattening of said extrudate provides a total draft rate of less than or equal to 5%.
6 . The method according to claim 1 , wherein said flattening of said extrudate provides a total draft rate of less than or equal to 3%.
7 . The method according to claim 1 , wherein said flattening of said extrudate provides a total draft rate of less than or equal to 1%.
8 . The method according to claim 1 , wherein said flattening of said extrudate provides a total draft rate of less than or equal to 0.5%.
9 . The method according to claim 1 , wherein said cooling is controlled to provide a grain size of said plate of 10-20 μm.
10 . The method according to claim 1 , wherein a coolant to cool the extrudate is provided in a die block during the extrusion.
11 . The method according to claim 1 , wherein a coolant to cool the extrudate is provided after the extrudate's passage of a die block.
12 . The method according to claim 1 , further comprising setting at least one supply parameter of a coolant based on a desired grain size of the extrudate.
13 . The method according to claim 12 , wherein said supply parameter is selected from a group consisting of supply position, supply rate, coolant temperature, coolant pressure, and type of coolant.
14 . The method according to claim 13 , wherein said setting is achieved by positioning a supply inlet for said coolant in a longitudinal direction of the extrudate.
15 . The method according to claim 14 , wherein said setting is at least partially achieved by selectively feeding the coolant to at least one of a plurality of supply inlets, which are spaced apart in the longitudinal direction of the extrudate.
16 . The method according to claim 14 , wherein the type of coolant is selected from the group consisting of air, inert gas, liquefied gas, water, oil, cutting fluid, aerosol, vapor, a combination of at least two thereof or no coolant at all.
17 . The method according to claim 13 , further comprising sensing a temperature in a die block, and setting the supply parameter based on the temperature.
18 . The method according to claim 1 , wherein an anode lead or lead alloy plate is manufactured.
19 . The method according to claim 18 , wherein cooling of the extrudate is controlled to provide a grain size of said anode lead or lead alloy plate of 50-300 μm.
20 . The method according to claim 18 , wherein cooling of the extrudate is controlled to provide a grain size of said anode lead or lead alloy plate of 100-200 μm.Join the waitlist — get patent alerts
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