US2015325583A1PendingUtilityA1

Semiconductor device and manufacturing method thereof

Assignee: RENESAS ELECTRONICS CORPPriority: May 20, 2011Filed: Jul 18, 2015Published: Nov 12, 2015
Est. expiryMay 20, 2031(~4.8 yrs left)· nominal 20-yr term from priority
G11C 16/0466H10D 30/021H10D 64/037H10D 30/694H10D 30/0413H10D 30/69H10D 1/68H01L 27/11517H01L 27/11563H10B 43/30H10B 43/00H10B 43/10H10B 41/00
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Claims

Abstract

A memory cell of a nonvolatile memory and a capacitive element are formed over the same semiconductor substrate. The memory cell includes a control gate electrode formed over the semiconductor substrate via a first insulating film, a memory gate electrode formed adjacent to the control gate electrode over the semiconductor substrate via a second insulating film, and the second insulating film having therein a charge storing portion. The capacitive element includes a lower electrode formed of the same layer of a silicon film as the control gate electrode, a capacity insulating film formed of the same insulating film as the second insulating film, and an upper electrode formed of the same layer of a silicon film as the memory gate electrode. The concentration of impurities of the upper electrode is higher than that of the memory gate electrode.

Claims

exact text as granted — not AI-modified
1 . A semiconductor device, comprising a memory cell of a nonvolatile memory, and a capacitive element which are formed over a semiconductor substrate, said memory cell comprising:
 a first gate electrode formed over the semiconductor substrate and comprised of silicon;   a second gate electrode arranged over the semiconductor substrate, formed adjacent to the first gate electrode, and comprised of silicon;   a first insulating film formed between the first gate electrode and the semiconductor substrate; and   a second insulating film formed between the second gate electrode and the semiconductor substrate and between the first gate electrode and the second gate electrode, said second insulating film having therein a charge storing portion,   said capacitive element comprising:   a first electrode formed over the semiconductor substrate and comprised of silicon; and   a second electrode formed over the first electrode via a capacity insulating film and comprised of silicon,   wherein a concentration of impurities of the second electrode is higher than that of impurities of the second gate electrode.   
     
     
         2 - 21 . (canceled)

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