Plug via formation by patterned plating and polishing

Abstract

Solder bump connections and methods for fabricating solder bump connections. A passivation layer is formed on a dielectric layer. A via opening extends through the passivation layer from a top surface of the passivation layer to a metal line in the dielectric layer. A mask on the top surface of the passivation layer includes a mask opening that is aligned with the via opening. A conductive layer is selectively formed in the via opening and the mask opening. The conductive layer projects above the top surface of the passivation layer. The method further includes planarizing the passivation layer and the conductive layer to define a plug in the via opening that is coupled with the metal line.

What is claimed is: 
     
         1 . A solder bump connection comprising:
 a passivation layer;   a via opening extending through the passivation layer; and   a plug in the via opening,   wherein the plug is comprised of a conductor, the passivation layer includes a top surface that is coplanar with the plug, and the top surface of the passivation layer is free of surface damage.   
     
     
         2 . The solder bump connection of  claim 1  further comprising:
 a seed layer in the via opening, the seed layer comprised of a material that promotes deposition of the conductor. 
 
     
     
         3 . The solder bump connection of  claim 2  further comprising:
 a crackstop opening in the passivation layer; and 
 an adhesion layer disposed in the crackstop opening and disposed between the seed layer and the passivation layer in the via opening, 
 wherein the crackstop opening is free of the seed layer. 
 
     
     
         4 . The solder bump connection of  claim 1  further comprising:
 a solder bump; 
 a dielectric layer; and 
 a metal line in the dielectric layer, 
 wherein the solder bump is coupled with the metal line by the plug.