US2015325258A1PendingUtilityA1
Stiff discrete insert array for thermal ptr management with desired induced stress state that reduces tendency for write pole erasure
Est. expiryAug 28, 2033(~7.1 yrs left)· nominal 20-yr term from priority
C23C 16/325G11B 5/3116C23C 16/22G11B 5/3136G11B 5/235G11B 5/3163G11B 5/6082
59
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Claims
Abstract
Embodiments of the present invention generally relate to a magnetic device having a discontinuous array of columns disposed near a magnetic pole. Each column has a length extending perpendicular to an air bearing surface and a width. The length is greater than the width.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A magnetic head, comprising:
a discontinuous array of columns; a dielectric material disposed between and over the discontinuous array of columns; a read head disposed over the dielectric material, and a write head disposed over the read head.
2 . The magnetic head of claim 1 , wherein each of the columns comprises a material selected from the group consisting of silicon carbide, tungsten and combinations thereof.
3 . The magnetic head of claim 2 , wherein the discontinuous array of columns are aligned in a cross-track direction and each of the columns has a cross section parallel to an air bearing surface and a length perpendicular to the air bearing surface.
4 . The magnetic head of claim 3 , wherein the cross section of each of the columns has a width and a thickness and the length is greater than the width or the thickness.
5 . The magnetic head of claim 3 , wherein the dielectric material comprises alumina.
6 . A method for forming a magnetic head, comprising:
depositing a write pole over a substrate; depositing an insert layer over the write pole; removing portions of the insert layer to form a discontinuous array of columns; and depositing a fill material between the discontinuous array of columns.
7 . The method of claim 6 , wherein the insert layer comprises a material selected from the group consisting of silicon carbide, tungsten and combinations thereof.
8 . The method of claim 6 , wherein the insert layer is deposited by physical vapor deposition.
9 . The method of claim 6 , wherein the fill material is deposited by chemical vapor deposition.
10 . The method of claim 6 , wherein the portions of the insert layer are removed by reactive ion etching.
11 . A magnetic head, comprising:
a write pole extending to an air bearing surface; and a discontinuous array of columns aligned in a cross-track direction and disposed over the write pole, wherein each of the columns has a length extending perpendicular to the air bearing surface and a width, and wherein the length is greater than the width, and wherein an insulating material is deposited between and over the discontinuous array of columns.
12 . The magnetic head of claim 11 , wherein each of the columns comprises a material selected from the group consisting of silicon carbide, tungsten and combinations thereof.
13 . The magnetic head of claim 11 , wherein each of the columns has a thickness that is less than the length, and wherein the thickness and the width form a surface recessed from the air bearing surface.
14 . The magnetic head of claim 11 , further comprising a non-magnetic layer disposed between the write pole and the discontinuous array of columns.
15 . The magnetic head of claim 14 , wherein the non-magnetic layer comprises alumina.Join the waitlist — get patent alerts
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