Carrier for use in double-side polishing apparatus and method of double-side polishing wafer

Abstract

A method provides a carrier used in a double-side polishing apparatus such that the carrier is disposed between upper and lower turn tables to which polishing pads are attached in the double-side polishing apparatus and holds a wafer interposed between the upper and lower turn tables in a holding hole formed in the carrier during polishing, including upper and lower main surface portions composed of a β-titanium alloy obtained from pure titanium containing 0.5 weight % or more of a β-stabilizing element. The carrier has a high abrasion resistance and can reduce its cost.

1 . A carrier used in a double-side polishing apparatus such that the carrier is disposed between upper and lower turn tables to which polishing pads are attached in the double-side polishing apparatus and holds a wafer interposed between the upper and lower turn tables in a holding hole formed in the carrier during polishing, comprising
 upper and lower main surface portions composed of a β-titanium alloy obtained from pure titanium containing 0.5 weight % or more of a β-stabilizing element.   
     
     
         2 . The carrier according to  claim 1 , wherein the entirety of the carrier is composed of the β-titanium alloy. 
     
     
         3 . The carrier according to  claim 1 , comprising a metal matrix and a coating composed of the β-titanium alloy, the coating being formed so as to cover upper and lower main surfaces of the metal matrix. 
     
     
         4 . The carrier according to  claim 3 , wherein the metal matrix is composed of pure titanium or the β-titanium alloy. 
     
     
         5 . A method of double-side polishing a wafer, comprising:
 disposing a carrier for use in a double-side polishing apparatus according to  claim 1  between upper and lower turn tables to which polishing pads are attached; and   double-side polishing the wafer while holding the wafer in the holding hole formed in the carrier.   
     
     
         6 . A method of double-side polishing a wafer, comprising:
 disposing a carrier for use in a double-side polishing apparatus according to  claim 2  between upper and lower turn tables to which polishing pads are attached; and   double-side polishing the wafer while holding the wafer in the holding hole formed in the carrier.   
     
     
         7 . A method of double-side polishing a wafer, comprising:
 disposing a carrier for use in a double-side polishing apparatus according to  claim 3  between upper and lower turn tables to which polishing pads are attached; and   double-side polishing the wafer while holding the wafer in the holding hole formed in the carrier.   
     
     
         8 . A method of double-side polishing a wafer, comprising:
 disposing a carrier for use in a double-side polishing apparatus according to  claim 4  between upper and lower turn tables to which polishing pads are attached; and   double-side polishing the wafer while holding the wafer in the holding hole formed in the carrier.