Bonding structure manufacturing method, heating and melting treatment method, and system therefor

Abstract

A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50 a, 50 b , and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50 a, 50 b are bonded with solder with the melted solder 54 interposed therebetween.

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         26 . A heating and melting treatment system for forming a heat-melting material by heating a member with said heat-melting material attached and performing heating and melting treatment on said heat-melting material, the heating and melting treatment system comprising:
 an application unit for applying said heat-melting material onto the member, and applying a temporary bonding agent onto a surface of the member in order to temporarily bond said heat-melting material;   a heating unit for heating the member with said heat-melting material temporarily bonded with said temporary bonding agent interposed therebetween; and   a providing unit for providing carboxylic acid vapor to the member in a chamber,   wherein before said heat-melting material is melted or while said heat-melting material is melted, the heating unit evaporates said temporary bonding agent in the chamber in which temporarily enhances a vacuum degree so that said temporary bonding agent is easily evaporated, and on the other hand, the heating unit heats the member so as to form said heat-melting material without flux in an atmosphere including the carboxylic acid vapor.   
     
     
         27 . The heating and melting treatment system according to  claim 31 , wherein
 said heat-melting material is a solder material or a eutectic-bonding agent.   
     
     
         28 . The heating and melting treatment system according to  claim 31 , wherein
 said temporary bonding agent is a non-reducing organic agent.   
     
     
         29 . The heating and melting treatment system according to  claim 33 , wherein
 said temporary bonding agent has a boiling point of 100 degrees Celsius to 350 degrees Celsius at a pressure of 1×10 2  to 1×10 5  Pa.   
     
     
         30 . The heating and melting treatment system according to  claim 33 , wherein
 said temporary bonding agent is at least one non-reducing organic agent selected from isobornyl cyclohexanol, terpineol, and propylene glycol phenyl ether.   
     
     
         31 . A bonding structure manufacturing system for manufacturing a bonding structure by bonding a plurality of members with a heat-melting material interposed therebetween, the bonding structure manufacturing system comprising:
 an application unit for applying a temporary bonding agent onto the bonded members with the heat-melting material being formed on at least one of the plurality of bonded members;   a heating unit for heating the plurality of bonded members temporarily bonded while the plurality of bonded members are stacked with said temporary bonding agent interposed therebetween; and   a providing unit for providing carboxylic acid vapor to the plurality of bonded members in a chamber,   wherein before the heat-melting material is melted or while the heat-melting material is melted, the heating unit evaporates said temporary bonding agent in the chamber in which temporarily enhances a vacuum degree so that said temporary bonding agent is easily evaporated, and on the other hand, the heating unit heats the bonded members so as to bond the bonded members without flux in an atmosphere including the carboxylic acid vapor.   
     
     
         32 . The bonding structure manufacturing system according to claim  36 , wherein
 said heat-melting material is a solder material or a eutectic-bonding agent.   
     
     
         33 . The bonding structure manufacturing system according to claim  36 , wherein
 said temporary bonding agent is a non-reducing organic agent.   
     
     
         34 . The bonding structure manufacturing system according to claim  38 , wherein
 said temporary bonding agent has a boiling point of 100 degrees Celsius to 350 degrees Celsius at a pressure of 1×10 2  to 1×10 5  Pa.   
     
     
         35 . The bonding structure manufacturing system according to claim  38 , wherein
 said temporary bonding agent is at least one non-reducing organic agent selected from isobornyl cyclohexanol, terpineol, and propylene glycol phenyl ether.