US2015311362A1PendingUtilityA1

Transparent-conductive-film laminate, manufacturing method therefor, thin-film solar cell, and manufacturing method therefor

Assignee: SUMITOMO METAL MINING COPriority: Nov 7, 2012Filed: Oct 11, 2013Published: Oct 29, 2015
Est. expiryNov 7, 2032(~6.3 yrs left)· nominal 20-yr term from priority
C23C 14/086H10F 77/707H10F 77/247H10F 77/244H10F 71/138H10F 77/251C09D 5/24C23C 14/34H01L 31/022466H01L 31/1884H01L 31/022483H01J 37/3429Y02P70/50Y02E10/542
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Claims

Abstract

The present invention provides a transparent-conductive-film laminate and a manufacturing method therefor, and provides a thin-film solar cell using the transparent-conductive-film laminate and a manufacturing method for the thin-film solar cell. The transparent-conductive-film laminate has a structure, the structure including an indium-oxide-based transparent conductive film (I) with a surface roughness (Ra) of not more than 1.0 nm formed on a translucent substrate, and a zinc-oxide-based transparent conductive film (II) formed on the indium-oxide-based transparent conductive film (I); and has a surface roughness (Ra) of not less than 30 nm as a laminate, a haze ratio of not less than 8%, a resistance value of not more than 30 Ω/sq., and an average absorptivity with respect to light in a wavelength range of 400 nm to 1200 nm of not more than 15%.

Claims

exact text as granted — not AI-modified
1 . A transparent-conductive-film laminate, having a structure, said structure comprising: an indium-oxide-based transparent conductive film (I) with a surface roughness (Ra) of not more than 1.0 nm formed on a translucent substrate; and a zinc-oxide-based transparent conductive film (II) formed on said indium-oxide-based transparent conductive film (I),
 wherein the transparent-conductive-film laminate has, as a laminate, a surface roughness (Ra) of not less than 30 nm, a haze ratio of not less than 8%, and a resistance value of not more than 30 Ω/sq., and has an average absorptivity with respect to light in a wavelength range of 400 nm to 1200 nm of not more than 15%.   
     
     
         2 . The transparent-conductive-film laminate according to  claim 1 , wherein the indium-oxide-based transparent conductive film (I) has a maximum difference in surface height (Rmax) of not more than 50 nm. 
     
     
         3 . The transparent-conductive-film laminate according to  claim 1 , wherein not more than 100 projections having a diameter of not more than 100 nm are present per 5 μm square in a surface of the indium-oxide-based transparent conductive film (I). 
     
     
         4 . The transparent-conductive-film laminate according to  claim 1 , the transparent-conductive-film laminate having an average absorptivity with respect to light in a wavelength range of 400 nm to 600 nm of not more than 15%. 
     
     
         5 . The transparent-conductive-film laminate according to  claim 1 , the transparent-conductive-film laminate having a structure comprising: the indium-oxide-based transparent conductive film (I) having a film thickness of not less than 10 nm and not more than 300 nm; and the zinc-oxide-based transparent conductive film (II) having a film thickness of not less than 200 nm and not more than 1000 nm. 
     
     
         6 . The transparent-conductive-film laminate according to  claim 1 , wherein the indium-oxide-based transparent conductive film (I) contains indium oxide as a main component, and contains at least one kind of additive metal element selected from Ti, Ga, Mo, Sn, W, and Ce. 
     
     
         7 . The transparent-conductive-film laminate according to  claim 1 , wherein the zinc-oxide-based transparent conductive film (II) contains zinc oxide as a main component, and contains at least one kind of additive metal element selected from Al, Ga, B, Mg, Si, Ti, Ge, Zr, and Hf. 
     
     
         8 . The transparent-conductive-film laminate according to  claim 1 , wherein the zinc-oxide-based transparent conductive film (II) contains zinc oxide as a main component, and contains at least one kind of additive metal element selected from Al and Ga at an atomic number ratio (Al+Ga)/(Zn+Al+Ga) of 0.3 to 6.5 atom % and at an atomic number ratio Al/(Al+Ga) of 30 to 70 atom %. 
     
     
         9 . A manufacturing method for a transparent-conductive-film laminate, comprising:
 a first deposition step of forming an indium-oxide-based transparent conductive film (I) having a film thickness of not less than 10 nm and not more than 300 nm on a translucent substrate by a sputtering method under conditions of a gas pressure of not less than 0.1 Pa and not more than 2.0 Pa and a substrate temperature of not more than 50° C.; and   a second deposition step of forming a zinc-oxide-based transparent conductive film (II) having a film thickness of not less than 200 nm and not more than 1000 nm on the indium-oxide-based transparent conductive film (I) by a sputtering method under conditions of a gas pressure of not less than 0.1 Pa and not more than 2.0 Pa and a substrate temperature of not less than 200° C. and not more than 450° C.   
     
     
         10 . The manufacturing method for a transparent-conductive-film laminate according to  claim 9 , wherein, in the first deposition step, H 2 O gas is introduced, and an indium-oxide-based transparent conductive film (I) is deposited under an atmosphere having an H 2 O partial pressure of not more than 0.05 Pa. 
     
     
         11 . The manufacturing method for a transparent-conductive-film laminate according to  claim 9 , wherein, in the first deposition step, H 2  gas is introduced, and an indium-oxide-based transparent conductive film (I) is deposited under an atmosphere having an H 2  partial pressure of not more than 0.03 Pa. 
     
     
         12 . The manufacturing method for a transparent-conductive-film laminate according to  claim 9 , wherein a sputtering target used for forming the zinc-oxide-based transparent conductive film (II) contains zinc oxide as a main component, and contains at least one kind of additive metal element selected from Al and Ga at an atomic number ratio (Al+Ga)/(Zn+Al+Ga) of 0.3 to 6.5 atom % and at an atomic number ratio Al/(Al+Ga) of 30 to 70 atom %. 
     
     
         13 . A thin-film solar cell, including:
 a translucent substrate; and   a transparent-conductive-film laminate, a photoelectric conversion layer unit, and a back surface electrode layer formed in that order on the translucent substrate,   wherein the transparent-conductive-film laminate
 has a structure including: an indium-oxide-based transparent conductive film (I) with a surface roughness (Ra) of not more than 1.0 nm formed on the translucent substrate; and a zinc-oxide-based transparent conductive film (II) formed on said indium-oxide-based transparent conductive film (I), and 
 has, as a laminate, a surface roughness (Ra) of not less than 30 nm, a haze ratio of not less than 8%, and a resistance value of not more than 30 Ω/sq., and has an average absorptivity with respect to light in a wavelength range of 400 nm to 1200 nm of not more than 15%. 
   
     
     
         14 . A manufacturing method for a thin-film solar cell,
 the thin-film solar cell including:   a translucent substrate; and   a transparent-conductive-film laminate, a photoelectric conversion layer unit, and a back surface electrode layer formed in that order on the translucent substrate,   wherein the transparent-conductive-film laminate is formed by a transparent-conductive-film laminate formation step, the transparent-conductive-film laminate formation step including:
 a first deposition step of forming an indium-oxide-based transparent conductive film (I) having a film thickness of not less than 10 nm and not more than 300 nm on the translucent substrate by a sputtering method under conditions of a gas pressure of not less than 0.1 Pa and not more than 2.0 Pa and a substrate temperature of not more than 50° C.; and 
 a second deposition step of forming a zinc-oxide-based transparent conductive film (II) having a film thickness of not less than 200 nm and not more than 1000 inn on the indium-oxide-based transparent conductive film (I) by a sputtering method under conditions of a gas pressure of not less than 0.1 Pa and not more than 2.0 Pa and a substrate temperature of not less than 200° C. and not more than 450° C.

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