US2015309086A1PendingUtilityA1

Measuring Method, Inspection Method, Inspection Device, Semiconductor Device, Method of Manufacturing a Semiconductor Device, and Method of Manufacturing an Element Substrate

Assignee: SEMICONDUCTOR ENERGY LABPriority: May 15, 2001Filed: Jul 6, 2015Published: Oct 29, 2015
Est. expiryMay 15, 2021(expired)· nominal 20-yr term from priority
Inventors:Masaaki Hiroki
H10P 74/00G01R 19/0084G01R 1/07G01R 31/265G01R 31/26G01R 31/01
54
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Claims

Abstract

An inspection method which simplifies an inspection step by eliminating the need to set probes on wiring or probe terminals, and an inspection device for performing the inspection step. A voltage is applied to each of inspected circuits or circuit elements to operate the same. Signal processing is performed on an output from each inspected circuit or circuit element during operation to form a signal (operation information signal) including information on the operating condition of the circuit or the circuit element. The operation information signal is amplified and the amplitude of an alternating current voltage separately input is modulated with the amplified operation information signal. The voltage of the modulated alternating current is read in a non-contact manner to determine whether the corresponding circuit or circuit element is non-defective or defective.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A measuring method of a circuit or a circuit element, comprising:
 operating the circuit or the circuit element by applying a voltage to the circuit or the circuit element in a non-contact manner, and   reading a voltage output from the circuit or the circuit element in a non-contact manner.

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