Cmp pad dresser having leveled tips and associated methods

Abstract

CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of superabrasive particles embedded in the matrix layer, where each superabrasive particle in the monolayer protrudes from the matrix layer. The difference in the protrusion distance between the highest protruding tip and the next highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 20 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less.

What is claimed is: 
     
         1 . A CMP pad dresser, comprising:
 a rigid support substrate having a plurality of superabrasive particles bonded thereto with a matrix material and protruding from the matrix material with a difference in protrusion distance between the highest 100 protruding superabrasive particle tips of less than or equal to about 50 microns.   
     
     
         2 . The dresser of  claim 1 , wherein the difference in protrusion distance between the highest protruding super abrasive particle tip and the 100 th  highest protruding superabrasive particle tip is less than or equal to about 40 microns. 
     
     
         3 . The dresser of  claim 1 , wherein the difference in protrusion distance between the highest protruding superabrasive particle tip and the 10 th  highest protruding superabrasive particle tip is less than or equal to about 20 microns. 
     
     
         4 . The dresser of  claim 3 , wherein the difference in protrusion distance between the highest protruding superabrasive particle tip and the 10 th  highest protruding superabrasive particle tip is less than or equal to about 10 microns. 
     
     
         5 . The dresser of  claim 1 , wherein the difference in protrusion distance between the highest protruding superabrasive particle tip and the second highest protruding superabrasive particle tip is less than or equal to about 15 microns. 
     
     
         6 . The dresser of  claim 5 , wherein the difference in protrusion distance between the highest protruding superabrasive particle tip and the second highest protruding superabrasive particle tip is less than or equal to about 10 microns. 
     
     
         7 . The dresser of  claim 1 , wherein the highest protruding superabrasive particle tip protrudes from the matrix material to a height greater than or equal to about 50 microns. 
     
     
         8 . The CMP pad dresser of  claim 1 , wherein the superabrasive particles have a mesh size of from 325/400 to 10/20. 
     
     
         9 . The dresser  claim 1 , wherein the superabrasive particles are oriented in an attitude having a sharp portion oriented towards a pad to be dressed. 
     
     
         10 . The dresser of  claim 9 , wherein the plurality of superabrasive particles are substantially all oriented in an attitude having either an apex or an edge portion oriented toward a pad to be dressed. 
     
     
         11 . The dresser of  claim 9 , wherein the sharp portion has degree of sharpness correlated with a geometric angle of from 30 degrees or less to 90 degrees or less. 
     
     
         12 . The dresser of  claim 11 , wherein the geometric angle is 45 degrees or less. 
     
     
         13 . The dresser of  claim 1 , wherein the superabrasive particles are diamond particles. 
     
     
         14 . The dresser of  claim 1 , wherein the superabrasive particles are polycrystalline diamond. 
     
     
         15 . The dresser of  claim 1 , wherein the matrix material is a member selected from the group consisting of: metal brazes, metal braze alloys, organic matrix materials, sintered materials, electroplated materials, and a combination thereof. 
     
     
         16 . The dresser of  claim 15 , wherein the bonding material is a metal braze alloy. 
     
     
         17 . A CMP pad dresser, comprising:
 a rigid support substrate;   a matrix material disposed on the support substrate; and   a plurality of superabrasive particles held in and protruding from the matrix material, wherein the highest 1% of superabrasive particle tips have a protrusion distance variance of about 80 microns or less.   
     
     
         18 . The CMP pad dresser of  claim 17 , wherein the variance is 70 microns or less. 
     
     
         19 . The CMP pad dresser of  claim 18 , wherein the variance is 50 microns or less. 
     
     
         20 . The CMP pad dresser of  claim 17 , wherein the superabrasive particles are oriented in an attitude having a sharp portion oriented towards a pad to be dressed, and said sharp portion has degree of sharpness correlated with a geometric angle of from 30 degrees or less to 90 degrees or less.