Method for connecting at least two components using a sintering process

Abstract

The invention relates to a method for connecting at least two components ( 18, 20 ) using a sintering process. The aim of the invention is to improve the sintering process. This is achieved in that the method has the following method steps: a) providing a starting material ( 10 ) of a sintering compound ( 22 ), comprising particles ( 12 ) which can be sintered and have at least one metal or at least one metal compound and comprising at least one polymeric, polymerizable, and/or monomeric organic compound ( 14 ), wherein the polymeric, polymerizable, and/or monomeric compound ( 14 ) has a flow temperature which is higher than or equal to the room temperature and lower than the sintering temperature, and the polymeric, polymerizable, and/or monomeric organic compound ( 14 ) further has a desorption temperature which is higher than the flow temperature and lower than or equal to the sintering temperature; b) arranging the starting material ( 10 ) between two components ( 18, 20 ) to be connected; c) heating the starting material ( 10 ) to a temperature (T 1 ) which is higher than or equal to the flow temperature of the polymeric, polymerizable, and/or monomeric organic compound ( 14 ) and lower than the desorption temperature of the polymeric, polymerizable, and/or monomeric organic compound ( 14 ) for a period of time (t 1 ); and d) heating the starting material ( 10 ) to a temperature (T 2 ) which is higher than or equal to the sintering temperature of the particles ( 12 ) which can be sintered, optionally under the influence of a sintering pressure, for a period of time (t 2 ), thereby forming a sintering compound ( 22 ).

1 . A method for connecting at least two components ( 18 ,  20 ) using a sintering process, comprising:
 a) providing a starting material ( 10 ) of a sintered connection ( 22 ), comprising sinterable particles ( 12 ), comprising at least one metal or at least one metal compound, and at least one polymeric, polymerizable and/or monomeric organic compound ( 14 ), wherein the polymeric, polymerizable and/or monomeric organic compound ( 14 ) has a flow temperature that is greater than or equal to room temperature and less than a sintering temperature of the sinterable particles, and wherein the polymeric, polymerizable and/or monomeric organic compound ( 14 ) also has a desorption temperature that is greater than the flow temperature and less than or equal to the sintering temperature;   b) arranging the starting material ( 10 ) between two components ( 18 ,  20 ) to be connected;   c) heating the starting material ( 10 ) to a temperature T 1 , which is greater than or equal to the flow temperature of the polymeric, polymerizable and/or monomeric organic compound ( 14 ) and less than the desorption temperature of the polymeric, polymerizable and/or monomeric organic compound ( 14 ), for a time t 1 ; and   d) heating the starting material ( 10 ) to a temperature T 2 , which is greater than or equal to the sintering temperature of the sinterable particles ( 12 ), for a time period t 2 , thereby forming a sintered connection ( 22 ).   
     
     
         2 . The method as claimed in  claim 1 , wherein the desorption temperature is a boiling temperature, a decomposition temperature or a reaction temperature of the polymeric, polymerizable and/or monomeric organic compound ( 14 ) with the sinterable particles and/or with sintered particles ( 12 ). 
     
     
         3 . The method as claimed in  claim 1 , wherein the sinterable particles ( 12 ) contain silver, gold, platinum, palladium and/or copper, an organic metal compound, a metal oxide, or a mixture comprising one or more of the aforementioned substances. 
     
     
         4 . The method as claimed in  claim 1 , wherein the polymeric, polymerizable and/or monomeric organic compound ( 14 ) comprises a polyolefin, a polyethylene copolymer, a polyketone or a mixture comprising one or more of the aforementioned substances. 
     
     
         5 . The method as claimed in  claim 1 , wherein the polymeric, polymerizable and/or monomeric organic compound ( 14 ) forms a matrix, in which the sinterable particles ( 12 ) are embedded, or wherein the polymeric, polymerizable and/or monomeric organic compound ( 14 ) takes the form of a coating on the sinterable particles ( 12 ). 
     
     
         6 . The method as claimed in  claim 1 , wherein the starting material ( 10 ) is applied to at least one component to be connected by printing, doctor blading or dispensing. 
     
     
         7 . The method as claimed in  claim 1 , wherein the starting material ( 10 ) has a transfer layer ( 24 ), which is arranged between at least two protective layers ( 26 ,  28 ). 
     
     
         8 . The method as claimed in  claim 7 , wherein the protective layers ( 26 ,  28 ) are removed before or during method step b). 
     
     
         9 . The method as claimed in  claim 7 , wherein the protective layers ( 26 ,  28 ) comprise polyethylene terephthalate. 
     
     
         10 . The method as claimed in  claim 1 , wherein the starting material ( 10 ) is provided in the form of a paste, a powder, granules or a film. 
     
     
         11 . The method as claimed in  claim 1 , wherein the polymeric, polymerizable and/or monomeric organic compound ( 14 ) is discharged or removed during or after method step c). 
     
     
         12 . The method as claimed in  claim 1 , wherein the polymeric, polymerizable and/or monomeric organic compound ( 14 ) contains at least one additive that reacts with the sinterable particles ( 12 ), while reducing the sintering temperature. 
     
     
         13 . The method as claimed in  claim 1 , wherein a sintered connection ( 22 ) that has an electrical conductivity of from greater than or equal to 30 MS/m is produced, and/or wherein a sintered connection ( 22 ) that has a thermal conductivity of from greater than or equal to 200 W/mK to less than or equal to 300 W/mK is produced. 
     
     
         14 . The method as claimed in  claim 1 , wherein an electronic component is used as one of the components to be connected and a substrate is used as another of the components ( 20 ) to be connected. 
     
     
         15 . The use of a method as claimed in  claim 1  for producing an electronic component. 
     
     
         16 . The method as claimed in  claim 1 , wherein method step d) includes heating the starting material ( 10 ) to a temperature T 2  under the effect of a sintering pressure. 
     
     
         17 . The method as claimed in  claim 1 , wherein the sinterable particles ( 12 ) contain silver, gold, platinum, palladium and/or copper, an organic metal compound, comprising silver carbonate, silver lactate or silver stearate, a metal oxide, comprising silver oxide, or a mixture comprising one or more of the aforementioned substances. 
     
     
         18 . The method as claimed in  claim 1 , wherein the polymeric, polymerizable and/or monomeric organic compound ( 14 ) comprises a polyolefin, comprising polyethylene and/or polypropylene, a polyethylene copolymer, a polyketone or a mixture comprising one or more of the aforementioned substances. 
     
     
         19 . The method as claimed in  claim 1 , wherein the starting material ( 10 ) has a transfer layer ( 24 ), which is arranged between at least two protective layers ( 26 ,  28 ), comprising a polymeric, polymerizable and/or monomeric organic compound. 
     
     
         20 . The method as claimed in  claim 1 , wherein the polymeric, polymerizable and/or monomeric organic compound ( 14 ) contains at least one additive that reacts with the organic metal compound, while reducing the sintering temperature. 
     
     
         21 . The method as claimed in  claim 1 , wherein a sintered connection ( 22 ) that has an electrical conductivity of from greater than or equal to 30 MS/m to less than or equal to 45 MS/m is produced, and/or wherein a sintered connection ( 22 ) that has a thermal conductivity of from greater than or equal to 200 W/mK to less than or equal to 300 W/mK is produced. 
     
     
         22 . The method as claimed in  claim 1 , wherein a sintered connection ( 22 ) that has an electrical conductivity of from greater than or equal to 36 MS/m to less than or equal to 44 MS/m is produced, and/or wherein a sintered connection ( 22 ) that has a thermal conductivity of from greater than or equal to 220 W/mK to less than or equal to 275 W/mK is produced. 
     
     
         23 . The method as claimed in  claim 1 , wherein an electronic component is used as one of the components to be connected and a substrate, comprising a copper compound, is used as another of the components ( 20 ) to be connected.