US2015305145A1PendingUtilityA1
Joining methods for bulk metallic glasses
Est. expiryNov 29, 2032(~6.3 yrs left)· nominal 20-yr term from priority
H10W 76/60H10W 70/24C22C 1/11B23K 20/023H10H 20/8506H10H 20/857H05K 1/0274H01L 33/62H01S 5/02236B23K 1/0016B23K 1/20H01L 33/486H05K 1/0306H01S 5/023H01S 5/0233B23K 20/233B32B 15/018C22C 45/10B23K 20/24B23K 2103/00B23K 20/16H01S 5/0235C22C 45/003B23K 2103/54B23K 2101/42
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Claims
Abstract
Bulk metallic glass having at least one surface: applying a contact layer to at least a portion of the at least one surface of the bulk metallic glass; applying a diffusion barrier layer to the contact layer; applying a cap layer to the diffusion barrier layer to form a layered bulk metallic glass; and joining a material to the layered bulk metallic glass.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method comprising:
providing a bulk metallic glass having at least one surface; applying a contact layer to at least a portion of the at least one surface of the bulk metallic glass; applying a diffusion barrier layer to the contact layer; applying a cap layer to the diffusion barrier layer to form a layered bulk metallic glass; and joining a material to the layered bulk metallic glass.
2 . The method according to claim 1 , wherein the contact layer comprises chromium and nickel, titanium, palladium, or combinations thereof.
3 . The method according to claim 1 , wherein the diffusion barrier layer comprises nickel, platinum, palladium, tungsten, or combinations thereof.
4 . The method according to claim 1 , wherein the cap layer comprises gold, platinum, or a combination thereof.
5 . The method according to claim 1 , wherein the diffusion barrier layer is comprised of dull-sulfamate nickel.
6 . The method according to claim 1 , further comprising depositing an insulating layer onto any bare portion of the bulk metallic glass prior to the applying the cap layer.
7 . The method according to claim 3 , wherein the insulating layer is comprised of silicon nitride, silicon oxynitride or a combination thereof.
8 . The method according to claim 1 , wherein the joining comprises soldering the material to the layered bulk metallic glass.
9 . The method according to claim 5 , wherein the soldering comprises using one or more solder preforms.
10 . The method according to claim 5 , wherein the soldering comprises pre-depositing solder onto the layered bulk metallic glass.
11 . The method according to claim 1 , wherein the material comprises a cap layer comprising gold.
12 . The method according to claim 1 , wherein the providing the bulk metallic glass comprises casting of a melt of the bulk metallic glass into a mold.
13 . The method according to claim 1 , wherein the providing the bulk metallic glass comprises casting the bulk metallic glass and thermoplastically forming the bulk metallic glass.
14 . The method according to claim 1 , wherein the providing the bulk metallic glass comprises forming or sintering a metallic glass powder.
15 . The method according to claim 1 , wherein the bulk metallic glass is a composite material comprising a metallic glass phase and one or more crystalline phases, amorphous phases, or combinations thereof.
16 . A bulk metallic glass submount comprising:
a bulk metallic glass having at least one surface; a contact layer on at least a portion of the at least one surface of the bulk metallic glass; a diffusion barrier layer on the contact layer; and a cap layer on the diffusion barrier layer.
17 . An electronic package comprising the bulk metallic submount according to claim 16 .
18 . The package according to claim 17 , wherein the package is an LED or a semiconductor laser package.
19 . The glass according to claim 17 , wherein the bulk metallic glass is a composite material comprising a metallic glass phase and one or more crystalline phases, amorphous phases, or combinations thereof.Join the waitlist — get patent alerts
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