Substrate treatment device

Abstract

A substrate treatment device which can detect a metal film remaining as a residue on a polished surface of a substrate after polishing with high accuracy is provided. The substrate treatment device includes a polishing section 3 that polishes a surface to be polished of the substrate to remove the metal film formed on the surface to be polished, a cleaning section 4 that cleans and dries the substrate polished by the polishing section 3 , and a temporary table 180 on which the substrate is temporarily placed after being polished by the polishing section 3 . Sensors 8, 9 for detecting the metal film remaining on the polished surface of the substrate are provided at the temporary table 180.

What is claimed is: 
     
         1 . A substrate treatment device comprising:
 a polishing section that polishes a surface to be polished of a substrate to remove a metal film formed on the surface to be polished;   a cleaning section that cleans and dries the substrate polished by the polishing section; and   a temporary table on which the substrate is temporarily placed after being polished by the polishing section,   wherein a sensor that detects a metal film remaining on the polished surface of the substrate is provided at the temporary table.   
     
     
         2 . The substrate treatment device according to  claim 1 , wherein
 the temporary table is provided between the polishing section and the cleaning section, and   the substrate polished by the polishing section is temporarily placed on the temporary table before being cleaned by the cleaning section.   
     
     
         3 . The substrate treatment device according to  claim 1 , wherein the sensor is configured to be able to detect a metal film on a whole surface of the polished surface of the substrate placed on the temporary table. 
     
     
         4 . The substrate treatment device according to  claim 1 , wherein the sensor is an eddy current type sensor. 
     
     
         5 . The substrate treatment device according to  claim 1 , wherein the sensor is an infrared laser type sensor. 
     
     
         6 . The substrate treatment device according to  claim 1 , wherein the sensor is an infrared camera type sensor.