Laminating system, ic sheet, scroll of ic sheet, and method for manufacturing ic chip

Abstract

Thin film integrated circuits are peeled from a substrate and the peeled thin film integrated circuits are sealed, efficiently in order to improve manufacturing yields. The present invention provides laminating system comprising transporting means for transporting a substrate provided with a plurality of thin film integrated circuits; first peeling means for bonding first surfaces of the thin film integrated circuits to a first sheet member to peel the thin film integrated circuits from the substrate; second peeling means for bonding second surfaces of the thin film integrated circuits to a second sheet member to peel the thin film integrated circuits from the first sheet member; and sealing means for interposing the thin film integrated circuits between the second sheet member and a third sheet member to seal the thin film integrated circuit with the second sheet member and the third sheet member.

What is claimed is: 
     
         1 . An IC sheet comprising:
 a plurality of thin film integrated circuits; and   two sheet members for sealing each of a plurality of thin film integrated circuits between the two sheet members,   wherein each of the plurality of thin film integrated circuits has a plurality of thin film transistors and a conductive layer serving as an antenna.   
     
     
         2 . The IC sheet according to  claim 1 , wherein each of the plurality of the thin film integrated circuits is regularly arranged. 
     
     
         3 . The IC sheet according to  claim 1 , wherein the two sheet members are laminate films. 
     
     
         4 . An IC sheet comprising:
 wounded two sheet members which seal each of a plurality of thin film integrated circuits between the two sheet members,   wherein each of the plurality of thin film integrated circuits has a plurality of thin film transistors and a conductive layer serving as an antenna.   
     
     
         5 . The IC sheet according to  claim 4 , wherein each of the plurality of the thin film integrated circuits is regularly arranged. 
     
     
         6 . The IC sheet according to  claim 4 , wherein the two sheet members are laminate films. 
     
     
         7 . A method for manufacturing an IC chip comprising the steps of:
 forming a peeling layer over a substrate having an insulating surface;   forming a plurality of thin film integrated circuits over the substrate;   forming an opening portion at a boundary between the thin film integrated circuits to expose the peeling layer;   introducing gas or liquid containing halogen fluoride into the opening portion to remove the peeling layer;   bonding first surfaces of the thin film integrated circuits to a first sheet member to peel the thin film integrated circuits from the substrate;   bonding second surfaces opposed to the first surfaces of the thin film integrated circuits to a second sheet member to peel the thin film integrated circuits from the first sheet member;   bonding the first surfaces of the thin film integrated circuits to a third sheet member to seal the thin film integrated circuits with the second sheet member and the third sheet member.   
     
     
         8 . The method for manufacturing an IC chip according to  claim 7 , wherein a plurality of thin film transistors and a conductive layer serving as an antenna are formed as the thin film integrated circuits over the substrate. 
     
     
         9 . A method for manufacturing an IC chip comprising the steps of:
 forming a plurality of thin film integrated circuits over a substrate;   bonding first surfaces of the thin film integrated circuits to a first sheet member to peel the thin film integrated circuits from the substrate;   bonding second surfaces opposed to the first surfaces of the thin film integrated circuits to a second sheet member to peel the thin film integrated circuits from the first sheet member; and   bonding the first surfaces of the thin film integrated circuits to a third sheet member to seal the thin film integrated circuits with the second sheet member and the third sheet member.   
     
     
         10 . The method for manufacturing an IC chip according to  claim 9 , wherein a plurality of thin film transistors and a conductive layer serving as an antenna are formed as the thin film integrated circuits over the substrate.