Electrical component and method of manufacturing the same

Abstract

According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer configured to form a cavity which stores the functional element on the substrate, the first layer having through holes, the first layer having a first recessed portion and a first projecting portion on an upper surface thereof, and the first layer having different film thicknesses in a direction perpendicular to a surface of the substrate, and a second layer formed on the first layer and configured to close the through holes.

What is claimed is: 
     
         1 . An electrical component comprising:
 a substrate;   a functional element formed on the substrate;   a first layer configured to form a cavity which stores the functional element on the substrate, the first layer having through holes, the first layer having a first projecting portion on an upper surface thereof, the first projecting portion being above the functional element and facing the functional element; and   a second layer formed on the first layer and configured to close the through holes.   
     
     
         2 . The component of  claim 1 , wherein the first layer has a second projecting portion on a lower surface thereof. 
     
     
         3 . The component of  claim 1 , wherein the first layer has a recessed portion on a lower surface thereof, and the recessed portion corresponds to the first projecting portion. 
     
     
         4 . The component of  claim 1 , wherein the first layer comprises an insulating film. 
     
     
         5 . The component of  claim 4 , wherein the first projecting portion comprises the insulating film. 
     
     
         6 . The component of  claim 4 , wherein the first layer has a second projecting portion on a lower surface thereof, and the second projecting portion comprises the insulating film. 
     
     
         7 . The component of  claim 4 , wherein the insulating film comprises one of an SiO x  film and an SiN film. 
     
     
         8 . An electrical component comprising:
 a substrate;   a functional element formed on the substrate;   a first layer configured to form a cavity which stores the functional element on the substrate, the first layer having through holes, the first layer having a first recessed portion and a first projecting portion on an upper surface thereof, and the first layer having different film thicknesses in a direction perpendicular to the substrate surface; and   a second layer formed on the first layer and configured to close the through holes,   wherein the first layer has a second recessed portion and a second projecting portion on a lower surface thereof, the second recessed portion corresponds to the first projecting portion, the second projecting portion corresponds to the first recessed portion, and a thickness of a stepped portion between the first projecting portion and the first recessed portion is larger than those of the first projecting portion and the first recessed portion.   
     
     
         9 . The component of  claim 8 , wherein the through holes are formed in the first recessed portion and/or the first projecting portion in the first layer. 
     
     
         10 . The component of  claim 8 , wherein the first projecting portion and the first recessed portion are formed by the second insulating film in midair. 
     
     
         11 . The component of  claim 9 , wherein the second insulating film is formed by one of an Si 02  film and an SiN film. 
     
     
         12 . The component of  claim 8 , wherein the film thickness of the stepped portion is substantially twice those of the first recessed portion and the first projecting portion.