Chemical mechanical polishing conditioner having different heights

Abstract

The present invention relates to a chemical mechanical polishing conditioner having different heights, comprising: a substrate; a binding layer disposed on the substrate; and multiple abrasive units placed on the binding layer. Each abrasive unit has an abrasive unit substrate and an abrasive layer which is a diamond film formed by chemical vapor deposition and has multiple abrasive tips. The abrasive units have a first tip height and a second tip height. The first tip height is different from the second tip height. The chemical mechanical polishing conditioner can adjust the surface roughness of the pad to be polished and improve the drainage of abrasive slurry.

What is claimed is: 
     
         1 . A chemical mechanical polishing conditioner having different heights comprising:
 a substrate;   a binding layer disposed on the substrate;   multiple abrasive units placed on the binding layer, each abrasive unit having an abrasive layer and an abrasive unit substrate, the abrasive layer being a diamond film formed on the abrasive unit substrate by chemical vapor deposition and having multiple abrasive tips;   wherein the abrasive units have a first tip height and a second tip height, and the first tip height is different from the second tip height.   
     
     
         2 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein a height difference between the first tip height and the second tip height is 5 micrometers to 100 micrometers, inclusive. 
     
     
         3 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 2 , wherein the height difference between the first tip height and the second tip height is 15 micrometers to 60 micrometers, inclusive. 
     
     
         4 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein the abrasive units have a third tip height and a fourth tip height. 
     
     
         5 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein the abrasive tips are in the shape of knife edges, cones, arcs, cylinders, pyramids, or prisms. 
     
     
         6 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein alignment directions of the abrasive tips are uniform, partially uniform, or different. 
     
     
         7 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein tip angles of the abrasive tips are equal, partially equal, or different. 
     
     
         8 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein horizontal distances between any two neighboring abrasive tips are equal, partially equal, or different. 
     
     
         9 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein thicknesses of the abrasive units are equal, partially equal, or different. 
     
     
         10 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein a middle layer is disposed between the abrasive layer and the abrasive unit substrate. 
     
     
         11 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 10 , wherein the middle layer is made of the group consisting of aluminum oxide, silicon carbide, and aluminum nitride. 
     
     
         12 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein the abrasive unit substrate is a conductive substrate or an insulating substrate. 
     
     
         13 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein the binding layer is made of a ceramic material, a brazing material, an electroplating material, a metallic material, or a polymeric material. 
     
     
         14 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 13 , wherein the polymeric material is epoxy resin, polyester resin, polyacrylate resin, or phenol resin. 
     
     
         15 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 13 , wherein the brazing material is made of the group consisting of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, and any combination thereof. 
     
     
         16 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein the substrate is a stainless steel substrate, a die steel substrate, a metal alloy substrate, a ceramic substrate, a plastic substrate, or any combination thereof. 
     
     
         17 . The chemical mechanical polishing conditioner having different heights as claimed in  claim 1 , wherein the substrate is a flat substrate or a notch substrate.