Chemical mechanical polishing conditioner

Abstract

The present invention relates to a chemical mechanical polishing conditioner, comprising: a substrate; a binding layer disposed on the substrate; and multiple abrasive units placed on the binding layer; wherein each abrasive unit has an abrasive unit substrate and an abrasive layer which is a diamond film formed by chemical vapor deposition and has multiple abrasive tips; wherein the abrasive units have uniform heights, such that the abrasive units form a planarized surface. Therefore, the present invention can improve planarization of the conditioner, enhance efficiency, and prolong lifetime.

What is claimed is: 
     
         1 . A chemical mechanical polishing conditioner comprising:
 a substrate;   a binding layer disposed on the substrate; and   multiple abrasive units placed on the binding layer, each abrasive unit having an abrasive layer and an abrasive unit substrate, the abrasive layer being a diamond film formed by a chemical vapor deposition and having multiple abrasive tips;   wherein heights of the abrasive units are equal to form a planarized surface.   
     
     
         2 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein a height difference between any two of the abrasive units is less than 20 micrometers. 
     
     
         3 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein the abrasive tips are in the shape of knife edges, cones, arcs, cylinders, pyramids, or prisms. 
     
     
         4 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein alignment directions of the abrasive tips are uniform, partially uniform, or different. 
     
     
         5 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein tip angles of the abrasive tips are equal, partially equal, or different. 
     
     
         6 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein horizontal distances between any two neighboring abrasive tips are equal, partially equal, or different. 
     
     
         7 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein thicknesses of the abrasive units are equal, partially equal, or different. 
     
     
         8 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein a middle layer is disposed between the abrasive layer and the abrasive unit substrate. 
     
     
         9 . The chemical mechanical polishing conditioner as claimed in  claim 8 , wherein the middle layer is made of the group consisting of aluminum oxide, silicon carbide, and aluminum nitride. 
     
     
         10 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein the abrasive unit substrate is a conductive substrate or an insulating substrate. 
     
     
         11 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein the binding layer is made of a ceramic material, a brazing material, a electroplating material, a metallic material, or a polymeric material. 
     
     
         12 . The chemical mechanical polishing conditioner as claimed in  claim 11 , wherein the polymeric material is epoxy resin, polyester resin, polyacrylate resin, or phenol resin. 
     
     
         13 . The chemical mechanical polishing conditioner as claimed in  claim 11 , wherein the brazing material is made of a group consisting of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, and any combination thereof. 
     
     
         14 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein the substrate is a stainless steel substrate, a die steel substrate, a metal alloy substrate, a ceramic substrate, a plastic substrate, or any combination thereof. 
     
     
         15 . The chemical mechanical polishing conditioner as claimed in  claim 1 , wherein the substrate is a flat substrate or a notch substrate.