Substrate treating apparatus

Abstract

An upper end of a tubular member surrounding a common pipe line is closed by a lid member. The lid member has an opening formed therein for supplying liquids to adjacent the rotation center on the back surface of a wafer. Deionized water supplied at normal temperature to the interior of the tubular member, after serving to cool the common pipe line, flows out of a lower end of the tubular member.

What is claimed is: 
     
         1 . A substrate treating apparatus having a front surface treating solution supply unit for supplying a treating solution to a front surface of a substrate spinning as held by a spin chuck, a common pipe line for supplying liquids to adjacent a rotation center on a back surface of the substrate spinning as held by the spin chuck, a back surface treating solution supply unit for supplying the treating solution to the common pipe line, and a warm water supply unit for supplying warm water to the common pipe line, the apparatus comprising:
 a cooling mechanism for cooling the common pipe line by supplying a fluid to outer peripheries of the common pipe line.   
     
     
         2 . The substrate treating apparatus according to  claim 1 , further comprising:
 an organic solvent supply unit for supplying an organic solvent to the front surface of the substrate spinning as held by the spin chuck;   wherein the warm water supply unit is arranged to supply the warm water to the common pipe line when the organic solvent supply unit supplies the organic solvent to the front surface of the substrate spinning as held by the spin chuck.   
     
     
         3 . The substrate treating apparatus according to  claim 2 , wherein the organic solvent is isopropyl alcohol. 
     
     
         4 . The substrate treating apparatus according to  claim 1 , further comprising:
 a multiple valve having a plurality of inlet and outlet ports;   wherein the common pipe line is connected to one of the inlet and outlet ports of the multiple valve;   the back surface treating solution supply unit is arranged to supply the treating solution to one of the inlet and outlet ports of the multiple valve; and   the warm water supply unit is arranged to supply the warm water to one of the inlet and outlet ports of the multiple valve.   
     
     
         5 . The substrate treating apparatus according to  claim 4 , further comprising;
 a switch valve disposed between the multiple valve and the common pipe line;   a deionized water supply unit for supplying deionized water at normal temperature to one of the inlet and outlet ports of the multiple valve; and   a suction unit for sucking an interior space of the multiple valve from one of the inlet and outlet ports of the multiple valve.   
     
     
         6 . The substrate treating apparatus according to  claim 1 , wherein the cooling mechanism is arranged to supply cooling water to the outer peripheries of the common pipe line. 
     
     
         7 . The substrate treating apparatus according to  claim 6 , wherein the cooling mechanism includes a tubular member surrounding the common pipe line, and is arranged to supply the cooling water to an interior of the tubular member. 
     
     
         8 . The substrate treating apparatus according to  claim 7 , further comprising:
 an inert gas supplying device for supplying an inert gas to the front surface of the substrate spinning as held by the spin chuck when drying the substrate by spinning the substrate held by the spin chuck at high speed;   wherein the cooling mechanism is arranged to supply the cooling water to the outer peripheries of the common pipe line while the inert gas supply device is supplying the inert gas to the front surface of the substrate spinning as held by the spin chuck.   
     
     
         9 . The substrate treating apparatus according to  claim 1 , wherein the treating solution is hydrofluoric acid.