US2015267290A1PendingUtilityA1

Deposition source, deposition apparatus, and method of manufacturing organic light-emitting display apparatus

Assignee: SAMSUNG DISPLAY CO LTDPriority: Feb 1, 2012Filed: Jun 1, 2015Published: Sep 24, 2015
Est. expiryFeb 1, 2032(~5.5 yrs left)· nominal 20-yr term from priority
C23C 14/243C23C 14/58B05D 3/067B05D 1/60H05B 33/04C23C 14/12H10K 71/00
58
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Claims

Abstract

A deposition source for depositing a deposition material on a substrate, the deposition source including: a nozzle disposed to face the substrate and discharge the deposition material toward the substrate; and a hardening portion disposed to at least one side of the nozzle for immediately hardening the deposition material discharged via the nozzle when the deposition material reaches the substrate. The deposition source being part of a deposition apparatus for manufacturing an organic light-emitting display having improved characteristics of a deposited film and encapsulation characteristics.

Claims

exact text as granted — not AI-modified
1 . A deposition source for depositing a deposition material on a substrate, the deposition source comprising:
 a nozzle disposed to face the substrate and discharge the deposition material toward the substrate; and   a hardening portion disposed to at least one side of the nozzle, the hardening portion immediately hardening the deposition material only after the deposition material reaches the substrate.   
     
     
         2 . The deposition source of  claim 1 , the hardening portion comprising a plurality of the hardening portions, the plurality of the hardening portions being disposed at opposite sides of the nozzle. 
     
     
         3 . The deposition source of  claim 2 , the hardening portions simultaneously hardening the deposition material. 
     
     
         4 . The deposition source of  claim 1 , the hardening portion hardening the deposition material by emitting ultraviolet (UV) light. 
     
     
         5 . The deposition source of  claim 1 , the hardening portion comprising an ultraviolet (UV) irradiation unit and a body generating UV light connected to the UV irradiation unit. 
     
     
         6 . The deposition source of  claim 1 , the hardening portion hardening the deposition material by emitting visible light. 
     
     
         7 . The deposition source of  claim 1 , further comprising a crucible accommodating the deposition material, the nozzle being connected to the crucible. 
     
     
         8 . The deposition source of  claim 1 , the nozzle receiving the deposition material from an evaporation apparatus disposed outside of the deposition source. 
     
     
         9 . The deposition source of  claim 1 , the hardening portion comprising a pair of hardening portions disposed to said at least one side of the nozzle. 
     
     
         10 . A deposition apparatus for depositing a deposition material on a substrate, the deposition apparatus comprising:
 a chamber;   a stage disposed inside the chamber, the substrate being mounted on said stage; and   a deposition source disposed to face the substrate, the deposition source comprising a nozzle for discharging the deposition material toward the substrate and a hardening portion disposed to at least one side of the nozzle, the hardening portion immediately hardening the deposition material only after the deposition material reaches the substrate.   
     
     
         11 . The deposition apparatus of  claim 10 , the substrate and the deposition source performing a deposition process while moving with respect to each other. 
     
     
         12 . The deposition apparatus of  claim 10 , further comprising a driving unit connected to the stage to move the stage. 
     
     
         13 . The deposition apparatus of  claim 10 , further comprising a driving unit connected to the deposition source to move the deposition source. 
     
     
         14 . The deposition apparatus of  claim 10 , the hardening portion comprising a plurality of the hardening portions, the plurality of the hardening portions being disposed at opposite sides of the nozzle. 
     
     
         15 . The deposition apparatus of  claim 14 , the hardening portions simultaneously hardening the deposition material. 
     
     
         16 . The deposition apparatus of  claim 10 , the hardening portion hardening the deposition material by emitting ultraviolet (UV) light. 
     
     
         17 . The deposition apparatus of  claim 10 , the hardening portion comprising an ultraviolet (UV) irradiation unit and a body generating UV light connected to the UV irradiation unit. 
     
     
         18 . The deposition apparatus of  claim 10 , the hardening portion hardening the deposition material by emitting visible light. 
     
     
         19 . The deposition source of  claim 10 , further comprising a crucible accommodating the deposition material, the nozzle being connected to the crucible. 
     
     
         20 . The deposition source of  claim 10 , further comprising an evaporation apparatus disposed outside of the chamber, the nozzle receiving the deposition material from the evaporation apparatus. 
     
     
         21 . The deposition source of  claim 20 , further comprising a liquid material supplying apparatus disposed outside of the chamber, the liquid material supplying apparatus supplying the deposition material to the evaporation apparatus. 
     
     
         22 . The deposition source of  claim 21 , further comprising an atomizer disposed between the liquid material supplying apparatus and the evaporation apparatus. 
     
     
         23 . The deposition source of  claim 10 , the hardening portion comprising a pair of hardening portions disposed to said at least one side of the nozzle. 
     
     
         24 . The deposition source of  claim 10 , the chamber comprising:
 a process chamber in which the deposition source and the substrate are disposed; and   an align chamber disposed adjacent to the process chamber, the align chamber aligning the substrate on the stage through an inlet/outlet between the process chamber and the align chamber.   
     
     
         25 - 30 . (canceled)

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