Nail lamp device

Abstract

A nail lamp device includes an inner housing having an inner housing substrate and an inner chamber surrounded by the inner housing substrate, at least one chip on board (COB) light emitting diode (LED) module disposed on an inner surface of the inner housing substrate by pasting-fitted and emitting light toward the inner chamber, a control module disposed on an outer surface of the inner housing substrate and electrically connected to the COB LED module, and an outer housing covering the inner housing and retaining a front opening of the inner chamber exposed. The COB LED module used by the nail lamp device is directly disposed on the inner surface of the inner housing substrate by pasting-fitted and has a plurality of LED elements arranged in array to accelerate the time required for the curing reaction of the resin coatings or glues coated on fingers. Moreover, the wavelength ranges of light can be selected with high elasticity, so as to enhance utility.

What is claimed is: 
     
         1 . A nail lamp device, comprising:
 an inner housing comprising an inner housing substrate and an inner chamber surrounded by the inner housing substrate, the inner chamber comprising at least one front opening, the inner housing substrate comprising an inner surface and an opposed outer surface, and the inner surface facing the inner chamber;   at least one chip on board (COB) light emitting diode (LED) module, each of the COB LED modules comprising:
 a heat-conductive substrate structure comprising a front side and a back side, the back side being disposed on the inner surface of the inner housing substrate by pasting-fitted; and 
 a plurality of LED elements electrically connected to the front side of the heat-conductive substrate structure and emitting light toward the inner chamber; 
   a control module disposed on the outer surface of the inner housing substrate and electrically connected to the COB LED module, so as to control the COB LED module; and   an outer housing covering the inner housing and retaining the front opening of the inner chamber exposed.   
     
     
         2 . The nail lamp device according to  claim 1 , wherein a plurality of through holes for wires are formed on the inner housing substrate, and each of the COB LED modules comprises at least two circuit terminals, such that the circuit terminals and the control module are electrically connected with a plurality of wires passing through the through holes for wires. 
     
     
         3 . The nail lamp device according to  claim 1 , wherein the heat-conductive substrate structure at least comprises:
 a metal board having a first surface and an opposed second surface, a plurality of projections being formed on the first surface, and the second surface serving as the back side of the heat-conductive substrate structure; and   a circuit board having a plurality of openings, the circuit board being disposed on the first surface of the metal board, and surfaces of the projections being exposed via the openings to serve as a portion of the front side of the heat-conductive substrate structure, and the LED elements being disposed on the surfaces of the projections and being electrically connected to the circuit board with a plurality of wires.   
     
     
         4 . The nail lamp device according to  claim 3 , wherein the metal board is a copper substrate. 
     
     
         5 . The nail lamp device according to  claim 1 , wherein the COB LED module is secured on the inner surface of the inner housing substrate by a locking element. 
     
     
         6 . The nail lamp device according to  claim 1 , wherein a material of the inner housing substrate is a plastic or a metal. 
     
     
         7 . The nail lamp device according to  claim 1 , wherein a back edge of the inner housing substrate extends downwards to form a back plate opposed to the front opening. 
     
     
         8 . The nail lamp device according to  claim 1 , wherein the LED elements of each of the COB LED modules emit light having a plurality of wavelength ranges. 
     
     
         9 . The nail lamp device according to  claim 8 , wherein the wavelength ranges of light correspond to a sort of a resin coating or a glue coated on nails. 
     
     
         10 . The nail lamp device according to  claim 8 , wherein one wavelength range of light is between 390 nanometer and 410 nanometer, and the other wavelength range of light is between 320 nanometer and 390 nanometer. 
     
     
         11 . The nail lamp device according to  claim 1 , comprising a plurality sets of the COB LED modules, and wherein the COB LED modules have same or different wavelength ranges of light, and the LED elements of a same COB LED module have the same wavelength range of light. 
     
     
         12 . The nail lamp device according to  claim 11 , wherein the wavelength range of light corresponds to a sort of a resin coating or a glue coated on nails. 
     
     
         13 . The nail lamp device according to  claim 11 , wherein one wavelength range of light is between 390 nanometer and 410 nanometer, and the other wavelength range of light is between 320 nanometer and 390 nanometer. 
     
     
         14 . The nail lamp device according to  claim 1 , wherein each of the COB LED modules further comprises a reflective cup secured on the heat-conductive substrate structure and facing the inner chamber, and the reflective cup is disposed around the LED elements.