Wiring board and method for manufacturing the same

Abstract

A method for manufacturing a wiring board includes positioning on a first insulation layer a wiring structure including an insulation layer and conductive patterns formed on the insulation layer, forming a second insulation layer on the first insulation layer and the wiring structure such that the wiring structure is interposed between the first insulation layer and the second insulation layer, forming a via conductor through the second insulation layer, and forming conductive patterns on the second insulation layer such that one of the conductive patterns on the second insulation layer is connected to the via conductor in the second insulation layer.

What is claimed is: 
     
         1 . A method for manufacturing a wiring board, comprising:
 positioning on a first insulation layer a wiring structure comprising an insulation layer and a plurality of conductive patterns formed on the insulation layer;   forming a second insulation layer on the first insulation layer and the wiring structure such that the wiring structure is interposed between the first insulation layer and the second insulation layer;   forming a via conductor through the second insulation layer; and   forming a plurality of conductive patterns on the second insulation layer such that one of the conductive patterns on the second insulation layer is connected to the via conductor in the second insulation layer.   
     
     
         2 . The method for manufacturing a wiring board according to  claim 1 , further comprising forming a plurality of first conductive patterns on the first insulation layer, wherein the forming of the via comprises forming the via connected to one of the first conductive patterns such that the via connects the one of the first conductive patterns on the first insulation layer and the one of the conductive patterns on the second insulation layer. 
     
     
         3 . The method for manufacturing a wiring board according to  claim 1 , wherein the positioning of the wiring structure on the first insulation layer comprises positioning the wiring structure on the first insulation layer such that the wiring structure covers a surface of the first insulation layer entirely. 
     
     
         4 . The method for manufacturing a wiring board according to  claim 1 , wherein the positioning of the wiring structure on the first insulation layer comprises positioning the wiring structure on the first insulation layer such that the wiring structure covers a portion of a surface of the first insulation layer, and the forming of the second insulation layer on the first insulation layer and the wiring structure comprises forming the second insulation layer on the first insulation layer and the wiring structure such that the second insulation layer extends over the surface of the first insulation layer and covers the wiring structure. 
     
     
         5 . The method for manufacturing a wiring board according to  claim 1 , further comprising forming a plurality of first conductive patterns on the first insulation layer, wherein the forming of the via comprises forming the via connected to one of the first conductive patterns such that the via connects the one of the first conductive patterns on the first insulation layer and the one of the conductive patterns on the second insulation layer, and each of the conductive patterns in the wiring structure has a pattern width which is set smaller than a pattern width of each of the first conductive patterns. 
     
     
         6 . The method for manufacturing a wiring board according to  claim 1 , further comprising forming a plurality of first conductive patterns on the first insulation layer, wherein forming the via connected to one of the first conductive patterns such that the via connects the one of the first conductive patterns on the first insulation layer and the one of the conductive patterns on the second insulation layer, and the conductive patterns in the wiring structure are formed such that a distance set between the conductive patterns in the wiring structure is set smaller than a distance set between the first conductive patterns. 
     
     
         7 . The method for manufacturing a wiring board according to  claim 1 , further comprising forming a plurality of first conductive patterns on the first insulation layer, wherein the first conductive patterns and the conductive patterns in the wiring structure are formed such that the first conductive patterns and the conductive patterns in the wiring structure have upper surfaces on the same plane. 
     
     
         8 . The method for manufacturing a wiring board according to  claim 1 , wherein the wiring structure further comprises an outer insulation layer formed on the insulation layer and covering the conductive patterns in the wiring structure, a via conductor penetrating through the outer insulation layer and a conductive pad connected to the via conductor. 
     
     
         9 . The method for manufacturing a wiring board according to  claim 8 , wherein the positioning of the wiring structure comprises interposing an adhesive layer between the first insulation layer and the wiring structure such that the adhesive layer is adhering the wiring structure to the first insulation layer. 
     
     
         10 . The method for manufacturing a wiring board according to  claim 1 , further comprising forming a plurality of mounting pads on the second insulation layer such that the plurality of mounting pads is positioned to mount a plurality of semiconductor elements, and the wiring structure includes a plurality of conductive pads such that the conductive pads are positioned to be connected to the plurality of mounting pads on the second insulation layer. 
     
     
         11 . The method for manufacturing a wiring board according to  claim 10 , further comprising:
 mounting a first semiconductor element on a plurality of first pads in the plurality of mounting pads; and   mounting a second semiconductor element on a plurality of second pads in the plurality of mounting pads,   wherein the forming of the mounting pads comprises forming the plurality of first pads positioned such that a distance set between the first pads is set smaller than a distance set between the second pads.   
     
     
         12 . The method for manufacturing a wiring board according to  claim 1 , wherein the plurality of conductive patterns in the wiring structure forms at least one signal line which connects a first semiconductor element and a second semiconductor element. 
     
     
         13 . The method for manufacturing a wiring board according to  claim 1 , wherein each of the conductive patterns in the wiring structure has L/S which is set in a range of from 1 μm/1 μm or greater to 5 μm/5 μm or less. 
     
     
         14 . The method for manufacturing a wiring board according to  claim 1 , further comprising forming a wiring line above the wiring structure and connecting one of the conductive patterns in the wiring structure and the one of the conductive patterns on the second insulation layer such that the one of the conductive patterns in the wiring structure is electrically connected to an external semiconductor element through the wiring line and the one of the conductive patterns on the second insulation layer. 
     
     
         15 . The method for manufacturing a wiring board according to  claim 1 , further comprising mounting a plurality of semiconductor elements on the second insulation layer, wherein the positioning of the wiring structure comprises positioning the wiring structure in a plurality such that one of the semiconductor elements is electrically connected to other ones of the semiconductor elements through the plurality of wiring structures, respectively. 
     
     
         16 . The method for manufacturing a wiring board according to  claim 1 , further comprising mounting a semiconductor element on the second insulation layer such that the semiconductor element is electrically connected to the wiring structure, wherein the second insulation layer forms an outermost insulation layer, and the wiring structure is formed in a portion of the second insulation layer. 
     
     
         17 . The method for manufacturing a wiring board according to  claim 2 , wherein the positioning of the wiring structure comprises positioning the wiring structure on a portion of a surface of the first insulation layer such that the wiring structure covers a portion of a surface of the first insulation layer, and the forming of the second insulation layer on the first insulation layer and the wiring structure comprises forming the second insulation layer on the first insulation layer and the wiring structure such that the second insulation layer extends over the surface of the first insulation layer and covers the wiring structure. 
     
     
         18 . The method for manufacturing a wiring board according to  claim 2 , wherein the wiring structure further comprises an outer insulation layer formed on the insulation layer and covering the conductive patterns in the wiring structure, a via conductor penetrating through the outer insulation layer and a conductive pad connected to the via conductor. 
     
     
         19 . The method for manufacturing a wiring board according to  claim 3 , wherein the wiring structure further comprises an outer insulation layer formed on the insulation layer and covering the conductive patterns in the wiring structure, a via conductor penetrating through the outer insulation layer and a conductive pad connected to the via conductor. 
     
     
         20 . The method for manufacturing a wiring board according to  claim 4 , wherein the wiring structure further comprises an outer insulation layer formed on the insulation layer and covering the conductive patterns in the wiring structure, a via conductor penetrating through the outer insulation layer and a conductive pad connected to the via conductor.