US2015254546A1PendingUtilityA1

Multiple layer card circuit boards

Assignee: DYNAMICS INCPriority: Jun 29, 2012Filed: May 21, 2015Published: Sep 10, 2015
Est. expiryJun 29, 2032(~5.9 yrs left)· nominal 20-yr term from priority
B32B 2425/00G06K 19/06206G06K 19/07707G06K 19/0702B32B 2457/08G06K 19/042B32B 2307/20Y10T428/31721Y10T428/15B32B 3/266G06K 19/07722G06K 19/07749B32B 27/281B32B 27/06
56
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Claims

Abstract

A powered card may include a circuit board with multiple layers, and may include multiple reader communication devices. One of the layers may include an RFID antenna. The layer including the RFID antenna may occupy an entire region of a card outside of a region including a magnetic stripe communication device.

Claims

exact text as granted — not AI-modified
1 - 19 . (canceled) 
     
     
         20 . A device comprising:
 a first layer including
 a first area, and 
 a second area, and 
   a second layer including
 a first electrically non-conductive area, and 
 a third area, 
   wherein said third area is aligned with said second area and said first electrically non-conductive area is aligned with said first area.   
     
     
         21 . The device of  claim 20 , wherein at least a portion of said first area includes a first component. 
     
     
         22 . The device of  claim 20 , further comprising an intermediate layer disposed between said first layer and said second layer. 
     
     
         23 . The device of  claim 20 , wherein said first electrically non-conductive area includes an absence of any material. 
     
     
         24 . The device of  claim 20 , wherein said first electrically non-conductive area includes one or more cutouts. 
     
     
         25 . The device of  claim 20 , wherein at least a portion of said first area includes a first component,
 said first electrically non-conductive area includes one or more cutouts, and   said one or more cutouts are aligned with said first component.   
     
     
         26 . The device of  claim 20 , wherein said first electrically non-conductive area includes a substrate without metallization. 
     
     
         27 . The device of  claim 20 , wherein said first electrically non-conductive area includes a polyimide sheet. 
     
     
         28 . The device of  claim 20 , wherein at least one of said first area, said second area, and said third area include one or more additional components. 
     
     
         29 . The device of  claim 20 , wherein said first component is a magnetic stripe communication device. 
     
     
         30 . The device of  claim 20 , wherein said first layer and said second layer each independently comprise one or more sublayers. 
     
     
         31 . The device of  claim 20 , further comprising:
 an intermediate layer disposed between said first layer and said second layer,   wherein said first layer, said second layer, and said intermediate layer each independently comprise one or more sublayers.   
     
     
         32 . A circuit board comprising:
 a first layer including a magnetic stripe communication device;   a second layer; and   a third layer,   wherein the second layer is between the first layer and the third layer, and   the third layer does not overlap a region of the circuit board including the magnetic stripe communication device.   
     
     
         33 . A device comprising:
 a circuit board including a first layer, a second layer, and a third layer,   wherein the second layer is between the first layer and the third layer,   a magnetic strip communication device extends through the first layer, and   the third layer does not overlap a region of the card including the magnetic stripe communication device.

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