Molded power supply system having a thermally insulated component

Abstract

A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the transport of thermal energy between the inductor and the system.

We claim: 
     
         1 - 13 . (canceled) 
     
     
         14 . A molded system comprising:
 a plurality of electronic components attached to a carrier, one of the components being an inductor of high thermal capacitance;   the surface of the inductor sealed with a hardened polymeric layer of high thermal resistance, the layer thermally insulating the inductor; and   molding compound encapsulating the carrier and the attached components including the inductor and the polymeric layer sealing the inductor's surface.   
     
     
         15 . The system of  claim 14  wherein the molding compound touches the surface of the hardened polymeric layer. 
     
     
         16 . The system of  claim 15  wherein the carrier is a QFN/SON-type leadframe; 
     
     
         17 . (canceled) 
     
     
         18 . (canceled) 
     
     
         19 . The system of  claim 14  wherein the components attached to a carrier constitute a power supply. 
     
     
         20 . The system of  claim 14  wherein the inductor is able to act as a source of thermal energy. 
     
     
         21 . The system of  claim 14  wherein the inductor is able to act as a sink of thermal energy. 
     
     
         22 . The system of  claim 14  wherein the polymeric layer is a thermoset polymer. 
     
     
         23 . The system of  claim 14  wherein the molding compound touches the polymeric layer. 
     
     
         24 . The system of  claim 22  wherein the thermoset polymer has a thermal resistivity 100 to 500 times higher than metals. 
     
     
         25 . The system of  claim 22  wherein the polymeric layer covers the surface uniformly. 
     
     
         26 . The system of  claim 25  wherein the layer has a thickness of 0.5 mm or less. 
     
     
         27 . The system of  claim 22  wherein the molding compound is an epoxy-based thermoset polymer with a high percentage of inorganic fillers.