Light-emitting device

Abstract

A method of manufacturing a light-emitting device includes forming a first optical element on a first carrier, wherein the first optical element comprises an opening; forming a light-emitting element in the opening; forming a second carrier on the first optical element; removing the first carrier after forming the second carrier on the first optical element; and forming a conductive structure under the first optical element.

What is claimed is: 
     
         1 . A light-emitting device, comprising:
 a first optical element comprises an opening;   a light-emitting element in the opening;   a second optical element on the light-emitting element;   an oxide layer between the light-emitting element and the second optical element; and   two separated conductive structures under the light-emitting element.   
     
     
         2 . The light-emitting device of  claim 1 , wherein the oxide layer comprises a wavelength-converting material. 
     
     
         3 . The light-emitting device of  claim 1 , wherein one of the separated conductive structures comprises a portion not covered by the light-emitting element. 
     
     
         4 . The light-emitting device of  claim 1 , further comprising an insulating-diffusing layer between the light-emitting element and one of the two separated conductive structures. 
     
     
         5 . The light-emitting device of  claim 1 , wherein the oxide layer is formed conformably around a contour of the light-emitting element. 
     
     
         6 . The light-emitting device of  claim 1 , wherein the first optical element has an inclined surface. 
     
     
         7 . The light-emitting device of  claim 1 , wherein the first optical element has a height larger than that of the light-emitting element. 
     
     
         8 . The light-emitting device of  claim 1 , wherein the second optical element comprises a transparent material. 
     
     
         9 . The light-emitting device of  claim 1 , further comprising an encapsulant formed between the light-emitting element and the second optical element. 
     
     
         10 . A light-emitting device, comprising:
 a light-emitting element;   a first optical element on the light-emitting element;   an oxide layer formed on the light-emitting element;   an encapsulant formed between the light-emitting element and the first optical element; and   two separated conductive structures under the light-emitting element and comprise a part not covered by the light-emitting element.   
     
     
         11 . The light-emitting device of  claim 10 , further comprising a carrier on the first optical layer. 
     
     
         12 . A light-emitting device, comprising:
 a first optical element comprising an opening;   a light-emitting element formed in the opening;   a second optical element on the light-emitting element;   a carrier on the second optical element; [ FIG. 2C ]   a wavelength-converting layer formed on the light-emitting element; and   two separated conductive structures under the light-emitting element and comprise a part not covered by the light-emitting element.