Rfid integrated circuits and tags with antenna contacts on multiple surfaces

Abstract

Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.

We claim: 
     
         1 . A Radio Frequency Identification (RFID) integrated circuit (IC) comprising:
 a first circuit block electrically coupled to a first antenna contact and to a second antenna contact; wherein:   the first antenna contact s disposed on a first surface of the IC;   the second antenna contact is disposed on a second surface of the IC different from the first surface; and   the first and second antenna contacts are electrically disconnected from each other.   
     
     
         2 . The RFID IC of  claim 1 , wherein the first antenna contact is not disposed on he second surface and the second antenna contact is not disposed on the first surface. 
     
     
         3 . The RFID IC of  claim 1 , wherein the first circuit block includes at least one of a charge pump, a modulator, a demodulator, a power management unit, an impedance matching circuit, a tuning circuit, and a processing unit. 
     
     
         4 . The RFID IC of  claim 1 , wherein the first circuit block includes a modulator and the modulator electrically couples to the first antenna contact through an electrically conductive substrate and is configured to generate an RF response by alternately electrically connecting and disconnecting the first and second antenna contacts. 
     
     
         5 . The RFID IC of  claim 1 , wherein the first circuit block includes a charge pump and the charge pump is coupled to the first antenna contact through the electrically conductive substrate such that a current flow is from the first antenna contact to the second antenna contact through the electrically conductive substrate during a first phase of an incident RF signal and is from the second antenna contact to the first antenna contact through the electrically conductive substrate during a second phase of the incident RF signal. 
     
     
         6 . The RFID IC of  claim 1 , wherein at least one of -the first antenna contact and the;
 second antenna contact includes at least one conductive pad spanning substantially an entire surface of the IC.   
     
     
         7 . The RFID IC of  claim 1 , wherein the electrical coupling to at least one of the antenna contacts is:
 through at least one of an electrically conductive substrate of the IC, a through-substrate via, and a side contact; and   at least one of galvanic and capacitive.   
     
     
         8 . The RFID IC of  claim 6 , wherein the at least one antenna contact includes a metallic or semi-metallic layer formed on the substrate if the electrical coupling is galvanic. 
     
     
         9 . The RFID IC of  claim 7 , wherein the side contact is deposited on a third surface of the different from the first and second surfaces. 
     
     
         10 . The RFID IC of  claim 1 , wherein the first circuit block and the first antenna contact are electrically connected to each other through a through-substrate via and the first antenna contact is electrically disconnected from the substrate. 
     
     
         11 . The RFID IC of  claim 1 , further comprising a memory for storing a first code and a second code, and a processing block operable to:
 transmit the first code if a first command is received;   receive a second command; and   transmit, responsive to receiving the second command, a combination made from at least portions of the first code and the second code, without receiving any commands while the combination is being transmitted.   
     
     
         12 . The RFID IC of  claim 1 , wherein the first circuit block is configured to extract power with a first efficiency from an RF wave incident on an antenna and begin operating according to a protocol When the extracted power exceeds a first value, the first circuit block comprising:
 a variable impedance element electrically coupled o the first and second antenna contacts; and   a tuning circuit configured to:
 begin operating when the extracted power exceeds a second value less than the first value, and 
 adjust the variable impedance element to enable the first circuit block to extract power from the RF wave with a second efficiency greater than the first efficiency. 
   
     
     
         13 . The RFID IC of  claim 1 , further comprising:
 at least one capacitor between at least one of the first and second antenna contacts and an antenna, the at least one capacitor containing a dielectric material, wherein the dielectric material includes at least one of a covering layer of the IC and a covering layer of the antenna.   
     
     
         14 . The RFID IC of  claim 1 , further comprising a processing block configured to:
 receive a refresh signal; and   in response o receiving the refresh signal, refresh an inventoried flag.   
     
     
         15 . The RFID IC of  claim 1 , further including a nonconductive stabilization layer, wherein the first antenna contact is disposed on a surface of the stabilization layer, and an electrical connection is formed between the first circuit block and the first antenna contact through an opening in the stabilization layer. 
     
     
         16 . The RFID IC of  claim 1 , wherein at east one of the first and second surfaces is a hexagonal shape. 
     
     
         17 . A method for manufacturing a Radio Frequency Identification (RFID) integrated circuit (IC), the method comprising:
 forming a first antenna contact on a first surface of the IC;   forming a second antenna contact on a second surface of the IC different from the first surface; and   electrically coupling a first IC circuit block to the first antenna contact and to the second antenna contact,   wherein the first and second antenna contacts are electrically disconnected from each other.   
     
     
         18 . The method of  claim 17 , wherein the first circuit block includes a modulator and the method further comprises electrically coupling the modulator to the first antenna contact through an electrically conductive substrate of the IC so as to enable the modulator to generate an RF signal by alternately electrically connecting and disconnecting the first and second antenna contacts. 
     
     
         19 . The method of  claim 17 , wherein one of the first antenna contact and the second antenna contact includes at least one conductive pad spanning substantially an entire surface of the IC. 
     
     
         20 . The method of  claim 17 , wherein the electrical coupling to at least one of the antenna contacts is at least one of galvanic and capacitive, and includes at least one of:
 forming a through-substrate via,   forming a side contact, and   electrically coupling through an electrically conductive substrate of the IC.   
     
     
         21 . The method of  claim 20 , wherein forming the first antenna contact includes forming a metallic or semi-metallic layer on the substrate if the electrical coupling is galvanic. 
     
     
         22 . The method of  claim 20 , further comprising depositing time side contact on a third surface of the IC different from the first and second surfaces. 
     
     
         23 . The method of  claim 22 , further comprising electro-plating at least one of the first antenna contact, the second antenna contact, and the side contact on the first surface, the second surface, and the third surface, respectively. 
     
     
         24 . The method of  claim 17 , further comprising electrically coupling the first circuit block and the first antenna contact through a through-substrate via and electrically disconnecting the first antenna contact form the substrate. 
     
     
         25 . The method of  claim 17 , further comprising forming at least one of the first and second surfaces into a hexagonal shape. 
     
     
         26 . A method of generating a radio-frequency (RF) signal with a Radio-Frequency Identification (RFID) integrated circuit (IE) having a first antenna contact disposed on a first surface and a second antenna contact disposed on a different surface, the method comprising:
 providing data to be encoded onto the RF signal, and   electrically connecting and disconnecting the first and second antenna contacts through an electrically conductive substrate so as generate the RF signal containing the data.   
     
     
         27 . The method of  claim 26 , further comprising encoding the data onto the RF signal by a modulator, such that a current flow is from the first antenna contact to the second antenna contact through the electrically conductive substrate during first phase of an incident RF signal and is from the second antenna contact to the first antenna contact through the electrically conductive substrate during a second phase of the incident RF signal, when the first and second antenna contacts are electrically connected. 
     
     
         28 . The method of  claim 26 , wherein the provided data in a public state of the IC is different, at least in part, from the provided data in a private state of the IC. 
     
     
         29 . The method of  claim 26 , wherein the provided data includes an item serial number derived at least in part from a tag serial number. 
     
     
         30 . A Radio Frequency Identification (RFID) tag comprising:
 an antenna having a first antenna terminal and a second antenna terminal;   a substrate having a first portion and a second portion; and   a dual-sided integrated circuit (IC) including a first circuit block electrically coupled to a first antenna contact and to a second antenna contact, wherein:
 the first antenna contact is disposed on a first surface of the IC, 
 the second antenna contact is disposed on a second surface of the IC different from the first surface, 
 the first and second antenna contacts are electrically disconnected from each other, 
 the IC is disposed on the first portion of the substrate; 
 an electrical connection is formed between the first antenna contact and the first antenna terminal, and 
 the second portion of the substrate is folded onto the first portion of the substrate so as to form an electrical connection between the second antenna contact and the second antenna terminal. 
   
     
     
         31 . The RFTD tag of  claim 30 , wherein:
 the first antenna terminal is disposed on the first portion of the substrate;   the second antenna terminal is disposed on the first portion of the substrate; and   the second portion of the substrate includes an electrical bridge.   
     
     
         32 . The RFID tag of  claim 30 , wherein the second antenna terminal is disposed on the second portion of the substrate. 
     
     
         33 . The RFID tag of  claim 30 , wherein the substrate includes at least one of a dimple, a through-substrate hole, and a slot, configured to at least partially contain the IC. 
     
     
         34 . The RFID tag of  claim 30 , wherein:
 the substrate includes a through-substrate hole,   the first antenna terminal is disposed on a back side of the substrate, and   the through-substrate hole and the first antenna terminal form a pocket for the IC.   
     
     
         35 . The RFID tag of  claim 30 , wherein the first circuit block includes least one of a charge pump, a modulator, a demodulator, a power management unit, an impedance matching circuit, a tuning circuit, and a processing unit. 
     
     
         36 . The RFID tag of  claim 30 , wherein the first circuit block includes a modulator and the triodulator electrically couples to the first antenna contact through an electrically conductive substrate and is configured to generate an RF response by alternately electrically connecting and disconnecting the first and second antenna contacts. 
     
     
         37 . The RFID tag of  claim 30 , wherein the first circuit block includes a charge pump and the charge pump is coupled to the first antenna contact through the electrically conductive substrate such that a current flow is from the first antenna contact to the second antenna contact through the electrically conductive substrate during a first phase of an incident RF signal and is from the second antenna contact to the first antenna contact through the electrically conductive substrate during a second phase of the incident RF signal. 
     
     
         38 . The RFID tag of  claim 30 , wherein at least one of the first antenna contact and the second antenna contact includes at least one conductive pad spanning substantially an entire surface of the IC. 
     
     
         39 . The RFID tag of aim  30 , wherein the electrical coupling to at least one of he antenna contacts is:
 through at least one of an electrically conductive substrate of the IC, a through-substrate via, and a side contact; and   one of galvanic and capacitive.   
     
     
         40 . The RFID tag of  claim 30 , wherein the IC further comprises a memory for storing a first code and a second code, and a processing block operable to:
 transmit the first code if a first command is received;   receive a second command; and   transmit, responsive to receiving the second command, a combination made from at least portions of the first code and the second code, without receiving any commands while the combination is being transmitted.   
     
     
         41 . The RFID tag of  claim 30 , wherein the first circuit block is configured to extract power with a first efficiency from an RF wave incident on the antenna and begin operating according to a protocol when the extracted power exceeds a first value, the first circuit block comprising:
 a variable impedance element electrically coupled to the first and second antenna contacts; and   a tuning circuit configured to:
 begin operating when the extracted power exceeds a second value less than the first value, and 
 adjust the variable impedance element to enable the first circuit block to extract power from the RF wave with a second efficiency greater than the first efficiency. 
   
     
     
         42 . The RFID tag of  claim 30 , wherein the IC further comprises:
 at least one capacitor between the first antenna contact and the first antenna terminal, the at least one capacitor containing a dielectric material, wherein the dielectric material includes at least one of a covering layer of the IC and a covering layer of the first antenna terminal.   
     
     
         43 . The RFID tag of aim  30 , wherein the IC further comprises a processing block configured to:
 receive a refresh signal and   in response to receiving the refresh signal, refresh an inventoried flag.   
     
     
         44 . The RFID tag of  claim 30 , wherein the IC further comprises a nonconductive stabilization layer, wherein the first antenna contact is disposed on a surface of the stabilization layer, and an electrical connection is formed between the first circuit block and the first antenna contact through an opening in the stabilization layer. 
     
     
         45 . A Radio Frequency Identification (RFID) tag comprising:
 an antenna having a first antenna terminal and a second antenna terminal;   a first substrate;   a second substrate; and   a dual-sided integrated circuit (IC) including a first circuit block electrically coupled to a first antenna contact and to a second antenna contact, wherein:
 the first antenna contact is disposed on a first surface of the IC, 
 the second antenna contact is disposed on a second surface of the IC different from the first surface, 
 the first and second antenna contacts are electrically disconnected from each other, 
 the IC is disposed on the first substrate; 
 an electrical connection is formed between the first antenna contact and the first antenna terminal, and 
 the second substrate is disposed onto the first substrate so as to form an electrical connection between the second antenna contact and the second antenna terminal. 
   
     
     
         46 . The RFID tag of  claim 45 , wherein the second antenna terminal is disposed on the first substrate, and the second substrate includes an electrical bridge. 
     
     
         47 . The RFID tag of  claim 45 , wherein the second antenna terminal is disposed on the second substrate. 
     
     
         48 . The RFID tag of  claim 45 , wherein the first substrate includes at least one of a dimple, a through-substrate hole, and a slot configured to at least partially contain the IC. 
     
     
         49 . The RFTD tag of  claim 45 , wherein:
 the first substrate includes a through-substrate hole,   the first antenna terminal is disposed on a back side of the first substrate, and   the through-substrate hole and the firs-t antenna terminal form a pocket for the IC.   
     
     
         50 . A Radio Frequency Identification (RFID tag comprising:
 an antenna;   a substrate: and   a dual-sided integrated circuit (IC) disposed on the substrate, the IC including a first circuit block electrically coupled to a first antenna contact and to a second antenna contact; wherein:
 the first antenna contact is disposed on a first surface of the IC; 
 the second antenna contact is disposed on a second surface of the IC different from the first surface; 
 the first and second antenna contacts are electrically disconnected from each other; and 
 the antenna is coupled to the first and second antenna contacts. 
   
     
     
         51 . A method of manufacturing a Radio Frequency Identification (RFID) tag, comprising:
 disposing a dual-sided Radio Frequency Identification (RFID) integrated circuit (IC) having a first antenna contact on a first surface of the IC and a second antenna contact on a second surface of the IC different from the first surface onto a first portion of a substrate;   forming an electrical connection between the first antenna contact and a first antenna terminal; and   folding a second portion of the substrate onto the first portion of the substrate so as to form an electrical connection between the second antenna contact and a second antenna terminal,   
     
     
         52 . The method of  claim 51 , further comprising:
 disposing the first antenna terminal on the first portion of the substrate; and   disposing the second antenna terminal on the first portion of the substrate,   wherein the second portion of the substrate includes an electrical bridge.   
     
     
         53 . The method of  claim 5 I further comprising disposing the second antenna terminal on the second portion of the substrate. 
     
     
         54 . The method of  claim 51 , further comprising providing at least one of a dimple a through-substrate hole and a slot configured to at least partially contain the IC. 
     
     
         55 . The method of  claim 51 , further comprising;
 providing a through-substrate hole in the substrate, and   disposing the first antenna terminal on a back side of the substrate, such that the through-substrate hole and the first antenna terminal form a pocket for the IC.   
     
     
         56 . The method of  claim 51 , further comprising providing at least one raised region on the substrate for guiding the positioning of the IC. 
     
     
         57 . A method of manufacturing a Radio Frequency Identification (RFID) tag, comprising:
 disposing a dual-sided Radio Frequency Identification (RFID) integrated circuit (IC) having a first antenna contact on a first surface of the IC and a second antenna contact on a second surface of the IC different from the first surface onto a first substrate;   forming an electrical connection between the first antenna contact and a first antenna terminal; and   disposing a second substrate onto the first substrate so as to form an electrical connection between the second antenna contact and a second antenna terminal,   
     
     
         58 . The method of  claim 57 , further comprising disposing the second antenna terminal on the first substrate, wherein the second substrate includes an electrical bridge. 
     
     
         59 . The method of  claim 57 , further comprising disposing the second antenna terminal on the second substrate. 
     
     
         60 . The method of  claim 57 , further comprising providing at least one of a dimple, a through-substrate hole, and a slot configured to at least partially contain the IC. 
     
     
         61 . The method of  claim 57 , further comprising:
 providing a through-substrate hole in the first substrate, and   disposing the first antenna terminal on a back side of the first substrate;   wherein the through-substrate hole and the first antenna terminal form a pocket for the IC.   
     
     
         62 . The method of  claim 57 , further comprising providing at least one raised region on the first substrate for guiding the positioning of the IC, 
     
     
         63 . A method of manufacturing a Radio Frequency Identification (RFID) tag, comprising:
 disposing a dual-sided Radio Frequency Identification (RFID) integrated circuit (IC) having a first antenna contact on a first surface of the IC and a second antenna contact on a second surface of the IC different from the first surface onto a substrate;   forming an electrical connection between e first antenna contact and a first antenna terminal; and   depositing a bridge that forms an electrical connection between the second antenna contact and a second antenna terminal on the substrate.   
     
     
         64 . The method of  claim 63 , wherein depositing the bridge includes at least one of printing the bridge onto the second antenna contact and depositing a bridge precursor onto the second antenna contact. 
     
     
         65 . The method of  claim 63 , further comprising processing the deposited bridge by applying at least one of heat and pressure to the deposited bridge. 
     
     
         66 . The method of  claim 63 , further comprising providing at least one of a dimple, a through-substrate hole, and a slot configured to at least partially contain the IC. 
     
     
         67 . The method of  claim 63 , further comprising:
 providing a through-substrate hole in the substrate, and   disposing the first antenna terminal on a back side of the substrate;   wherein the through-substrate hole and the first antenna terminal form a pocket for the IC.   
     
     
         68 . The method of  claim 63 , further comprising providing at least one raised region on the substrate for guiding the positioning of the IC. 
     
     
         69 . A method of manufacturing a Radio Frequency Identification (RFID comprising:
 providing a tag substrate;   providing a dual-sided Radio Frequency identification (RFID) integrated circuit (IC) having a first antenna contact on a first surface of the IC and a second antenna contact on a second surface of the IC different from the first surface; and   depositing the IC on the tag substrate such that the first antenna contact electrically connects to a first antenna terminal on the substrate and the second antenna contact is exposed.   
     
     
         70 . The method of  claim 69 , further comprising providing at least one of a dimple, a through-substrate hole, and a slot configured to at least partially contain the IC. 
     
     
         71 . The method of  claim 69 , further comprising:
 providing a through-substrate hole in the tag substrate, and   disposing the first antenna terminal on a back side of the tag substrate,   wherein the through-substrate hole and the first antenna terminal form a pocket for the IC.   
     
     
         72 . The method of  claim 69 , further comprising providing at least one raised region on the substrate for guiding the deposition of the IC. 
     
     
         73 . The method of  claim 69 , further comprising providing, at a desired IC location, a lower potential energy than at other locations on the tag substrate. 
     
     
         74 . The method of  claim 69 , wherein depositing the IC comprises dispensing the IC from a bulk dispenser. 
     
     
         75 . The method of  claim 69 , wherein depositing the IC comprises using at least one of a fluid flow, gravity, and tag substrate vibration to position the IC. 
     
     
         76 . A method of manufacturing a Radio Frequency Identification (RFID) tag, comprising:
 providing a tag substrate;   providing a dual-sided Radio Frequency Identification (RFID) integrated circuit (IC) having a first antenna contact on a first surface of the IC and a second antenna contact on a second surface of the IC different from the first surface, wherein the IC has an electric charge of a first polarity;   inducing an electric charge of a second polarity different from the first polarity at a location on the tag substrate; and   depositing the charged IC on the tag substrate such that the IC is electrically attracted to the location.   
     
     
         77 . The method of  claim 76 , further comprising providing at least one of a dimple, a through-substrate hole, and a slot configured to at least partially contain the IC. 
     
     
         78 . The method of  claim 76 , further comprising:
 providing a through-substrate hole in the tag substrate, and   disposing the first antenna terminal on a back side of the tag substrate,   wherein the through-substrate hole and the first antenna terminal form a pocket for the IC.   
     
     
         79 . The method of  claim 76 , further comprising using a laser to induce the electric charge of the second polarity at the location. 
     
     
         80 . The method of  claim 76 , further comprising providing at least one raised region on the tag substrate for guiding the deposition of the IC. 
     
     
         81 . The method of  claim 76 , further comprising providing, at the location, a lower potential energy than at other locations on the tag substrate. 
     
     
         82 . The method of  claim 76 , wherein depositing the IC comprises dispensing the IC from a bulk dispenser. 
     
     
         83 . The method of  claim 76 , wherein depositing the IC further comprises using at least one of fluid flow, gravity, and tag substrate vibration to position the IC. 
     
     
         84 . A method of manufacturing a Radio Frequency Identification (RFID) tag, comprising:
 providing a tag substrate having an aperture at a location;   providing a dual-sided Radio Frequency Identification (RFID) integrated circuit (IC) having a first antenna contact on a first surface of the IC and a second antenna contact on a second surface of the IC different from the first surface;   providing a gas flow through the aperture by a pressure differential between a front side and a back side of the tag substrate; and   using the gas flow to deposit the IC at the location.   
     
     
         85 . The method of  claim 84 , further comprising providing at least one of a dimple, a through-substrate hole, and a slot configured to at least partially contain the IC. 
     
     
         86 . The method of  claim 84 , further comprising:
 providing a through-substrate hole at the location,   disposing the first antenna terminal on a back side of the tag substrate, and   providing the aperture through the first antenna terminal;   wherein the through-substrate hole and the first antenna terminal form a pocket for the IC.   
     
     
         87 . The method of  claim 84 , further comprising providing at least one raised region on the tag substrate for guiding the positioning of the IC. 
     
     
         88 . The method of  claim 84 , further comprising providing the location with a lower potential energy than other locations on the tag substrate. 
     
     
         89 . The method of  claim 84  wherein depositing the IC comprises dispensing the IC from a bulk dispenser.