Semiconductor device and method for manufacturing the same

Abstract

According to one embodiment, a semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

What is claimed is: 
     
         1 . A semiconductor device comprising:
 a first molded body having a first resin that covers a first light emitting element, a part of a first primary lead electrically connected to the first light emitting element, a first light receiving element and a part of a secondary lead electrically connected to the first light receiving element;   a second molded body having the first resin that covers a second light emitting element, a part of a second primary lead electrically connected to the second light emitting element, a second light receiving element and a part of the secondary lead electrically connected to the second light receiving element; and   a third molded body having a second resin that covers the first molded body and the second molded body,   wherein the secondary lead has a connecting portion between the first molded body and the second molded body, and the connecting portion is covered with the first resin.   
     
     
         2 . The device according to  claim 1 , wherein
 the first light emitting element is opposed to the first light receiving element, wherein a light emitting surface of the first light emitting element faces a light receiving surface of the first light receiving element; and   the second light emitting element is opposed to the second light receiving element, wherein a light emitting surface of the second light emitting element faces a light receiving surface of the second light receiving element.   
     
     
         3 . The device according to  claim 1 , wherein a main component of the first resin is same as a main component of the second resin. 
     
     
         4 . The device according to  claim 1 , wherein the connecting portion of the secondary lead is covered with the second resin on contact with the first resin. 
     
     
         5 . The device according to  claim 1 , wherein
 the first resin transmits lights emitted from the first light emitting element and the second light emitting element; and   the second resin blocks an external light.   
     
     
         6 . The device according to  claim 1 , wherein the third molded body includes a shield portion between the first molded body and the second molded body; and
 the shield portion blocks a light emitted from the second light emitting element and propagating toward the first light receiving element, and blocks a light emitted from the first light emitting element and propagating toward the second light receiving element.   
     
     
         7 . The device according to  claim 1 , wherein the secondary lead includes a first mount portion, a second mount portion and the connecting portion between the first mount portion and the second mount portion;
 the first light receiving element is mounted on the first mount portion; and   the second light receiving element is mounted on the second mount portion.   
     
     
         8 . The device according to  claim 1 , further comprising other secondary leads, wherein
 each of the first light receiving element and the second light receiving element includes a light receiving surface, a power supply terminal and a signal terminal; and   a first one of the other secondary leads is electrically connected to the power supply terminal; and   a second one of the other secondary leads is electrically connected to the signal terminal.   
     
     
         9 . The device according to  claim 8 , wherein the first one of the other secondary leads has a first portion, a second portion and another connecting portion between the first portion and the second portion;
 the first portion is disposed in the first molded body;   the second portion is disposed in the second molded body; and   the another connecting portion is covered with the first resin.   
     
     
         10 . The device according to  claim 1 , wherein each of the first primary lead, the second primary lead and the secondary lead includes a portion extending from the third molded body. 
     
     
         11 . The device according to  claim 10 , wherein
 the third molded body has a first side surface and a second side surface opposite to the first side surface;   the first primary lead and the second primary lead extend from the first side surface; and   the secondary lead extends from the second side surface.