High frequency module

Abstract

A high frequency module includes a module board, a connection member, and test terminals. The module board has a first surface on which a transmit antenna and a receive antenna are provided and a second surface on which a signal processing IC is provided, the second surface of the module board being the opposite side of the first surface. The connection member contains wiring for connecting the signal processing IC disposed on the second surface of the module board with another board. The test terminals are connected with the signal processing IC disposed on the second surface of the module board and arranged on the first surface of the module board.

What is claimed is: 
     
         1 . A high frequency module comprising:
 a module board;   antennas disposed on a first surface of the module board;   signal processing circuits disposed on a second surface of the module board which is an opposite side of the first surface of the module board;   a connection member connected with the module board and another board and containing wiring for the signal processing circuits; and   one or more test terminals connected with the signal processing circuits and disposed on the first surface of the module board.   
     
     
         2 . The high frequency module according to  claim 1 , wherein an area between the antennas and the one or more test terminals on the module board is covered with resist or dielectric. 
     
     
         3 . The high frequency module according to  claim 1 , wherein the antennas yield a maximum radiation efficiency in a 30-GHz or higher band. 
     
     
         4 . The high frequency module according to  claim 1 , wherein ends of the antennas are separated from the end of the one or more test terminals by at least a ¾ wavelength. 
     
     
         5 . The high frequency module according to  claim 1 , wherein the one or more test terminals are a terminal distinct from a ground terminal and a plurality of test terminals are arranged on the module board at symmetrical positions about a center of the module board. 
     
     
         6 . The high frequency module according to  claim 1 , further comprising:
 a ground pattern disposed on the first surface of the module board between the antennas and the one or more test terminals.   
     
     
         7 . The high frequency module according to  claim 6 , wherein the ground pattern is in a shape that surrounds a circumference of the one or more test terminals in at least two directions. 
     
     
         8 . The high frequency module according to  claim 1 , wherein the one or more test terminals are disposed at positions that are not in a direction of maximum radiation of the antennas if the antennas have directivity. 
     
     
         9 . The high frequency module according to  claim 1 , wherein the one or more test terminals are covered with a resist layer.