Method and system of heat dissipation utilizing a heat pipe in combination with an extruded heat sink

Abstract

In one aspect, the present invention relates to a heat-dissipation system. The heat-dissipation system includes a heat sink having a plurality of fins coupled thereto and a heat pipe having an evaporator portion and a condenser portion. The heat pipe has a heat-transfer fluid disposed therein. The evaporator portion is disposed within the heat sink and the condenser portion is disposed externally to the heat sink. A fan is arranged to circulate air over the plurality of fins and the condenser portion. A heat-transfer coefficient of the heat-transfer fluid supplements a heat-transfer coefficient of air moving over the condenser portion.

What is claimed is: 
     
         1 . A heat-dissipation system comprising:
 a heat sink having a first plurality of fins coupled thereto, the heat sink having a lower face for placement in contact with a heat-generating element, the heat sink comprising a notch formed in the lower face for receiving a heat pipe;   the heat pipe being formed as a low-profile extrusion and comprising an evaporator portion and a condenser portion and having a heat-transfer fluid disposed therein, the evaporator portion being disposed within the notch of the heat sink such that a surface of the heat pipe is placed in contact with the heat-generating element, the condenser portion being disposed externally to the heat sink;   wherein the heat sink secures the heat pipe in contact with the heat-generating element; and   wherein a heat-transfer capability of the heat pipe supplements a heat-transfer capability of the heat sink.   
     
     
         2 . The system of  claim 1 , comprising a fan that circulates air downwardly through the heat sink. 
     
     
         3 . The system of  claim 1 , comprising a fan that circulates air across the heat sink. 
     
     
         4 . The system of  claim 1 , wherein the heat pipe comprises a shape selected from the group consisting of U shaped, right-angle bend, straight, and toroidal. 
     
     
         5 . The system of  claim 1 , comprising a second plurality of fins coupled to the condenser portion. 
     
     
         6 . The system of  claim 1 , wherein the second plurality of fins are aligned with the first plurality of fins. 
     
     
         7 . The system of  claim 1 , wherein the heat-generating element is a warm side of a thermoelectric element. 
     
     
         8 . The system of  claim 7 , wherein a cool side of the thermoelectric element is thermally exposed to a manifold having a plurality of channels disposed therethough, the plurality of channels having surface enhancement to facilitate optimal heat transfer. 
     
     
         9 . The system of  claim 1 , wherein vaporization of the heat-transfer fluid absorbs heat from the heat sink. 
     
     
         10 . The system of  claim 1 , wherein the heat pipe comprises a plurality of micro-tubes formed therein. 
     
     
         11 . The system of  claim 10 , wherein the plurality of micro tubes facilitate capillary movement of the heat-transfer fluid. 
     
     
         12 . The system of  claim 1 , wherein the heat sink increases an operational thermal range of the heat pipe beyond the thermal range of the heat pipe if the heat sink were not present. 
     
     
         13 . A method of increasing a heat-transfer capability of a heat sink, the method comprising:
 thermally exposing a heat sink to a heat-generating component, the heat sink comprising a first plurality of fins coupled thereto, and having a notch formed in a lower surface thereof;   arranging a heat pipe through the heat sink, the heat pipe comprising a low-profile extrusion and having an evaporator portion disposed within the heat sink and a condenser portion disposed outwardly of the heat sink, the evaporator portion being received into the notch;   wherein the heat sink secures the heat pipe in contact with the heat-generating element; and   wherein a heat-transfer capability of the heat pipe supplements a heat-transfer capability of the heat sink.   
     
     
         14 . The method of  claim 13 , comprising arranging a second set of fins proximate the condenser portion. 
     
     
         15 . The method of  claim 13 , comprising forming the heat pipe with a plurality of micro tubes therein. 
     
     
         16 . The method of  claim 13 , comprising reducing, via the heat pipe, a size of the heat sink. 
     
     
         17 . The method of  claim 13 , comprising absorbing heat from the heat-generating component via vaporization of a heat-transfer fluid disposed in the heat pipe. 
     
     
         18 . The method of  claim 13 , comprising circulating, via a fan, air over the heat sink and the condenser portion. 
     
     
         19 . A heat-dissipation system comprising:
 a first heat sink having a plurality of fins coupled thereto, the first heat sink having a first lower face for placement in contact with a warm side of a first thermoelectric element, the first heat sink comprising a notch formed in the lower face for receiving a first heat pipe;   the first heat pipe being formed as a low-profile extrusion and comprising an evaporator portion and a condenser portion, the first heat pipe having a heat-transfer fluid disposed therein, the evaporator portion being disposed within the notch of the first heat sink such that a surface of the first heat pipe is placed in contact with the warm side of the first thermoelectric element, the condenser portion being disposed externally to the heat sink;   a manifold having a second heat-transfer fluid disposed therein, the manifold being placed in thermal contact with a cool side of the first thermoelectric element;   wherein the heat sink secures the first heat pipe in contact with the first thermoelectric element; and   wherein a heat-transfer capability of the first heat pipe supplements a heat-transfer capability of the first heat sink.   
     
     
         20 . The heat-dissipation system of  claim 19 , comprising:
 a second heat sink having a plurality of fins coupled thereto, the second heat sink having a second lower face for placement in contact with a warm side of a second thermoelectric element, the second heat sink comprising a notch formed in the lower face for receiving a second heat pipe;   the second heat pipe being formed as a low-profile extrusion and comprising an evaporator portion and a condenser portion, the second heat pipe having a heat-transfer fluid disposed therein, the evaporator portion being disposed within the notch of the second heat sink such that a surface of the second heat pipe is placed in contact with the warm side of the second thermoelectric element, the condenser portion being disposed externally to the heat sink;   a cool side of the second thermoelectric element being placed in thermal contact with the manifold;   wherein the heat sink secures the second heat pipe in contact with the second thermoelectric element; and   wherein a heat-transfer capability of the second heat pipe supplements a heat-transfer capability of the second heat sink.