Chemical mechanical polishing conditioner with high performance

Abstract

The present invention relates to a chemical mechanical polishing conditioner with high performance, comprising a substrate; a binding layer disposed on the substrate; and a plurality of abrasive particles fixed directly on the substrate by the binding layer, or each abrasive particle disposed on a metal fixing seat and the substrate have a plurality of blind holes and a plurality of through holes, so that the metal fixing seats are installed into the blind holes or the through holes, and the metal fixing seat fixed on the substrate by the binding layer; wherein the abrasive particles are treated by a surface processing treatment to make the abrasive particles have specific cutting edge angles, crystal structures, tip heights, or tip orientations. Therefore, the present invention can control the profile of each abrasive particle to accomplish the best polishing performance.

1 . A chemical mechanical polishing conditioner with high performance, comprising:
 a substrate;   a binding layer disposed on the substrate; and   a plurality of abrasive particles fixed directly on the substrate by the binding layer, or each abrasive particle disposed on a metal fixing seat, and the substrate having a plurality of blind holes or a plurality of through holes, so that the metal fixing seat is installed into these blind holes or these through holes, and the metal fixing seat is fixed on the substrate by the binding layer;   wherein the abrasive particles are performed a surface processing treatment, so that these abrasive particles have specific cutting edge angles, crystal structures, tip heights or tip orientations, or these abrasive particles are not performed a processing treatment.   
     
     
         2 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein the cutting edge angles of these abrasive particles are 30 degrees to 150 degrees. 
     
     
         3 . The chemical mechanical polishing conditioner with high performance of  claim 2 , wherein the cutting edge angles of these abrasive particles are 60 degrees or 90 degrees. 
     
     
         4 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein crystal structure of these abrasive particles is a tetrahedron, a hexahedron, an octahedron or the other shape with specific cutting function. 
     
     
         5 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein these abrasive particles have the same tip heights. 
     
     
         6 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein these abrasive particles have different tip heights. 
     
     
         7 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein each abrasive particle is fixed on the metal fixing seat by the abrasive binding layer. 
     
     
         8 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein these abrasive particles have plane bottom or non-plane bottom. 
     
     
         9 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein the metal fixing seat has a plane top or a blind hole at the top. 
     
     
         10 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein the abrasive particles are artificial diamonds, nature diamonds, polycrystalline diamonds or cubic boron nitride. 
     
     
         11 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein the abrasive particles have a particle size of 30 to 2000 μm. 
     
     
         12 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein a composition of the binding layer is made of a ceramic material, a brazing material, an electroplating material, a metallic material, or a polymer material. 
     
     
         13 . The chemical mechanical polishing conditioner with high performance of  claim 7 , wherein a composition of the abrasive binding layer is made of a ceramic material, a brazing material, an electroplating material, a metallic material, or a polymer material. 
     
     
         14 . The chemical mechanical polishing conditioner with high performance of  claim 12 , wherein the brazing material is at least one selected from the group consisting of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, and combinations thereof. 
     
     
         15 . The chemical mechanical polishing conditioner with high performance of  claim 12 , wherein the polymer material is epoxy resin, polyester resin, polyacrylic resin, phenolic resin. 
     
     
         16 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein the substrate is made of stainless steel substrate, mold steel substrate, metal alloy substrate, ceramic material substrate or polymer material substrate or combinations thereof. 
     
     
         17 . The chemical mechanical polishing conditioner with high performance of  claim 1 , wherein the substrate has a plurality of blind holes, so that the metal fixing seat is installed into each blind hole. 
     
     
         18 . A method for manufacturing chemical mechanical polishing conditioner with high performance, comprising:
 providing a plurality of abrasive particles and a substrate having a binding layer;   providing a surface processing treatment to make the abrasive particles have specific cutting edge angles, crystal structures, tip heights, or tip orientations; and   fixing directly each abrasive particle on the substrate by the binding layer; or fixing each abrasive particle on the metal fixing seat, so that the metal fixing seat is fixed on the substrate by the binding layer.   
     
     
         19 . The method for manufacturing chemical mechanical polishing conditioner with high performance of  claim 18 , wherein the surface process treatment is a mechanical polishing method, a chemical etching method, or a laser processing method. 
     
     
         20 . The method for manufacturing chemical mechanical polishing conditioner with high performance of  claim 18 , wherein a fixing method of the binding layer is ceramic sintering method, a brazing method, an electroplating method, a metal sintering method, or a polymer hardening method. 
     
     
         21 . The method for manufacturing chemical mechanical polishing conditioner with high performance of  claim 18 , wherein each abrasive particle is fixed on the metal fixing seat by the abrasive binding layer. 
     
     
         22 . The method for manufacturing chemical mechanical polishing conditioner with high performance of  claim 21 , wherein the fixing method of the abrasive binding layer is ceramic sintering method, a brazing method, an electroplating method, a metal sintering method, or a polymer hardening method.