Front facing piggyback wafer assembly

Abstract

Front facing piggyback wafer assembly. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. The plurality of integrated circuit devices are singulated to form individual integrated circuit devices. The carrier wafer may be processed to form integrated circuit structures prior to the attaching.

What is claimed is: 
     
         1 . An apparatus comprising:
 a first wafer substrate attached to a second dissimilar wafer substrate;   a semiconducting device formed on said second wafer substrate; and   a plurality of conductive structures coupling said semiconducting device to contacts on said first wafer substrate.   
     
     
         2 . The apparatus of  claim 1  wherein said plurality of conductive structures comprise vias through said first wafer substrate. 
     
     
         3 . The apparatus of  claim 1  wherein said contacts on said first wafer substrate comprise package contacts for electrical coupling to a printed circuit board. 
     
     
         4 . The apparatus of  claim 1  wherein said first wafer substrate comprises Silicon. 
     
     
         5 . The apparatus of  claim 1  wherein said first wafer substrate comprises is transparent to ultra-violet light and suitable for bonding to sapphire. 
     
     
         6 . The apparatus of  claim 1  wherein said second wafer substrate comprises sapphire. 
     
     
         7 . The apparatus of  claim 1  wherein said first wafer substrate comprises a plurality of integrated circuits formed thereon. 
     
     
         8 . The apparatus of  claim 1  wherein said first wafer substrate is configured to conduct heat energy away from said semiconducting device formed on said second wafer substrate. 
     
     
         9 . The apparatus of  claim 1  wherein said semiconducting device comprises radio frequency circuitry. 
     
     
         10 . The apparatus of  claim 1  where said semiconductor device comprises a light emitting diode. 
     
     
         11 . The apparatus of  claim 10  further comprising:
 a base for coupling to an alternating current supply; and 
 electronics configured to convert said alternating current to electrical power suitable for driving said light emitting diode. 
 
     
     
         12 . The apparatus of  claim 10  further comprising:
 a processor for operating a graphical user interface; 
 a display for displaying said graphical user interface; and 
 wherein said light emitting diode is configured to illuminate said display.