Sandpaper and method of use thereof

Abstract

Disclosed herein is sandpaper that includes a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper. The sandpaper includes a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper. Further, the sandpaper includes a bonding layer having a back surface located opposite the first sanding surface and second sanding surface and a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are substantially planar.

I claim: 
     
         1 . Sandpaper comprising:
 a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper;   a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper;   a bonding layer having a back surface located opposite the first sanding surface and second sanding surface; and   a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are at least one of substantially planar and planar.   
     
     
         2 . The sandpaper of  claim 1 , wherein the buffer is a buffer layer located between the bonding surface and the second plurality of particles, and wherein the buffer layer is distinct from the bonding layer. 
     
     
         3 . The sandpaper of  claim 1 , wherein the buffer is a thicker portion of the bonding layer in the second area of the sandpaper. 
     
     
         4 . The sandpaper of  claim 1 , wherein the first area and the second area are separated along a length of the sandpaper. 
     
     
         5 . The sandpaper of  claim 1 , wherein the second area is larger than the first area. 
     
     
         6 . The sandpaper of  claim 1 , wherein the combination of the first plurality of particles and the second plurality of particles covers the entirety of a sanding surface of the sandpaper. 
     
     
         7 . The sandpaper of  claim 1 , wherein the sandpaper is a circular sheet, the first area is an inner circle and the second area circumferentially extends from the first area such that the second area concentrically surrounds the first area. 
     
     
         8 . The sandpaper of  claim 1 , wherein the first grain size is 40-grade particles and wherein the second grain size is 60-grade particles. 
     
     
         9 . The sandpaper of  claim 1 , wherein the sandpaper is a twenty-five yard roll of sandpaper. 
     
     
         10 . Sandpaper comprising:
 a bonding layer having a bonding surface and a back surface;   a first sandpaper portion having a first grain size attached to the bonding surface of the bonding layer over a first area of the sandpaper;   a second sandpaper portion having a second grain size that is smaller than the first grain size, the second sandpaper portion located over a second area of the sandpaper; and   a buffer located between the second sandpaper portion and the back surface, the buffer configured to raise the second plurality of particles such that a first sanding surface corresponding to the first sanding portion of the sandpaper and a second sanding surface corresponding to the second sanding portion of the sandpaper are at least one of substantially planar and planar.   
     
     
         11 . The sandpaper of  claim 10 , wherein the buffer is a buffer layer that is distinct from the bonding portion. 
     
     
         12 . The sandpaper of  claim 10 , wherein the buffer is a thicker portion of the bonding layer located in the second area of the sandpaper. 
     
     
         13 . The sandpaper of  claim 10 , wherein the first area and the second area are separated along a length of the sandpaper. 
     
     
         14 . The sandpaper of  claim 10 , wherein the second area is larger than the first area. 
     
     
         15 . The sandpaper of  claim 10 , wherein the combination of the first plurality of particles and the second plurality of particles covers the entirety of the sandpaper sheet. 
     
     
         16 . The sandpaper of  claim 10 , wherein the sandpaper is circular, the first area is an inner circle and the second area circumferentially extends from the first area such that the second area circumferentially surrounds the first area. 
     
     
         17 . The sandpaper of  claim 10 , wherein the first grain size is 40-grade particles and wherein the second grain size is 60-grade particles. 
     
     
         18 . The sandpaper of  claim 10 , wherein the sandpaper sheet is a twenty-five yard roll of sandpaper. 
     
     
         19 . A method of sanding a floor comprising:
 providing a sandpaper, the sandpaper including:
 a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper; 
 a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper; 
 a bonding layer having a back surface located opposite the first sanding surface and second sanding surface; and 
 a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are at least one of substantially planar and planar; 
   attaching the sandpaper around a drum of a drum sander, wherein the first plurality of particles circumferentially surrounds the drum and extends from a first side of the drum, wherein the second plurality of particles circumferentially surrounds the drum and extends from a second opposing side of the drum;   rotating the drum of the drum sander and the attached sandpaper;   moving the drum sander along the floor; and   sanding the floor with the sandpaper.   
     
     
         20 . The method of sanding a floor of  claim 19 , further comprising leading the sanding of the floor with the second side of the drum of the drum sander.