Wireless communication device with rf integrated circuit having an on-chip gyrator

Abstract

An integrated circuit includes an on-chip gyrating circuit that generates a motion parameter based on motion of the IC. An RF transceiver generates an outbound RF signal from outbound data and that generates inbound data from an inbound RF signal. A processing module processes the motion parameter, generates the outbound data, and receives the inbound data.

What is claimed is: 
     
         1 . An integrated circuit (IC) comprising:
 a motion detecting circuit that generates a motion parameter based on motion of the IC;   an RF transceiver, for coupling to a plurality of antennas, that generates an outbound RF signal from outbound data based on at least one transmitter control signal and that generates inbound data from an inbound RF signal based on a receiver control signal, wherein the receiver control signal and the transmitter control signal correspond to a selected one of a plurality of multi-input multi-output (MIMO) configurations of the RF transceiver; and   a processing module, coupled to the motion detecting circuit and the RF transceiver, and that processes the motion parameter, generates the outbound data, and receives the inbound data and wherein processing module adjusts the receiver control signal and the transmitter control signal, based on the motion parameter.   
     
     
         2 . The IC of  claim 1  wherein the motion detecting circuit includes one of:
 a piezoelectric gyroscope; 
 a vibrating wheel gyroscope; 
 a tuning fork gyroscope; 
 a hemispherical resonator gyroscope; and 
 a rotating wheel gyroscope. 
 
     
     
         3 . The IC of  claim 1  wherein the IC is integrated in a package having a substrate and a first die and wherein the RF transceiver and the motion detecting circuit are implemented on the first die. 
     
     
         4 . The IC of  claim 1  wherein the IC is integrated in a package having a substrate, a first die and a second die and wherein the RF transceiver is implemented on the first die and the motion detecting circuit is implemented on the second die. 
     
     
         5 . The IC of  claim 1  wherein the IC is integrated in a package having a substrate and a first die wherein the RF transceiver, processing module and the motion detecting circuit are implemented on the first die. 
     
     
         6 . The IC of  claim 1  wherein the IC is integrated in a package having a substrate and a first die and a second die, and wherein the RF transceiver and processing module are implemented on the first die and the motion detecting circuit is implemented on the second die. 
     
     
         7 . The IC of  claim 1  wherein the IC is integrated in a package with a top and a bottom having a plurality of bonding pads to connect the IC to a circuit board and wherein the motion detecting circuit is integrated along the bottom of the package. 
     
     
         8 . The IC of  claim 7  wherein the bonding pads are arrayed in an area of the bottom with an open center portion and wherein the motion detecting circuit is integrated in the open center portion. 
     
     
         9 . The IC of  claim 1  wherein the IC is integrated in one of, a surface mount package, and an in-line package. 
     
     
         10 . The IC of  claim 1  wherein the outbound data is based on the motion parameter. 
     
     
         11 . An integrated circuit (IC) comprising:
 an motion detecting circuit that generates a motion parameter based on motion of the IC;   an RF transceiver for coupling to a plurality of antennas, that generates an outbound RF signal from outbound data based on a transmitter control signal and that generates inbound data from an inbound RF signal wherein the transmitter control signal controls the RF transceiver to a selected one of a plurality of multi-input multi-output (MIMO) configurations; and   a processing module, coupled to the motion detecting circuit and the RF transceiver, and that processes the motion parameter, generates the outbound data, and receives the inbound data and wherein processing module adjusts the transmitter control signal, based on the motion parameter.   
     
     
         12 . The IC of  claim 11  wherein the IC is integrated in a package having a substrate and a first die and wherein the RF transceiver and the motion detecting circuit are implemented on the first die. 
     
     
         13 . The IC of  claim 11  wherein the IC is integrated in a package having a substrate, a first die and a second die and wherein the RF transceiver is implemented on the first die and the motion detecting circuit is implemented on the second die. 
     
     
         14 . The IC of  claim 11  further comprising:
 a processing module, coupled to a memory module, the motion detecting circuit and the RF transceiver, and that processes the motion parameter to produce motion data, generates the outbound data that includes the motion data, and receives the inbound data. 
 
     
     
         15 . The IC of  claim 14  wherein the IC is integrated in a package having a substrate and a first die wherein the RF transceiver, processing module and the motion detecting circuit are implemented on the first die. 
     
     
         16 . The IC of  claim 14  wherein the IC is integrated in a package having a substrate and a first die and a second die, and wherein the RF transceiver and processing module are implemented on the first die and the motion detecting circuit is implemented on the second die. 
     
     
         17 . The IC of  claim 11  wherein the IC is integrated in a package with a top and a bottom having a plurality of bonding pads to connect the IC to a circuit board and wherein the motion detecting circuit is integrated along the bottom of the package. 
     
     
         18 . The IC of  claim 17  wherein the bonding pads are arrayed in an area of the bottom with an open center portion and wherein the motion detecting circuit is integrated in the open center portion. 
     
     
         19 . The IC of  claim 11  wherein the motion detecting circuit is implemented with microelectromechanical systems (MEMS) technology. 
     
     
         20 . A wireless communication device comprises:
 an integrated circuit (IC) that includes:
 a die that supports:
 a processing module coupled to process a motion parameter to produce motion data, to convert outbound data into an outbound symbol stream, to convert an inbound symbol stream into inbound data, and to generate a transmit control signal based on the motion data; and 
 a radio frequency (RF) transceiver that generates an outbound RF signal from an outbound symbol stream based on the transmit control signal, and that generates an inbound symbol stream from an inbound RF signal; and 
 
 a package substrate that supports the die and an motion detecting circuit that generates the motion parameter based on motion of the wireless communication device; and 
   an antenna structure, including a plurality of antennas, coupled to the RF transceiver;   wherein the transmit control signal controls the RF transceiver to a selected one of a plurality of multi-input multi-output (MIMO) configurations.